A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe

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Abstract

This paper presents a rectangular waveguide-to-coplanar waveguide (CPW) transition at D-band (110–170 GHz) using wire bonding probe. A conventional CPW is
designed and fabricated based on both quartz and glass substrates for estimating the losses at D-band and testing the fabrication processes. Two transition prototypes at D-band using E-plane probe and wire bonding probe are designed, fabricated, and measured in a back-to-back configuration. The system packaging approaches and scattering parameters of the transition prototypes are compared. For both on-chip and carrier substrate approaches, chips can be tested individually before packaged into a system and extra connections are not required. The fabricated rectangular waveguide-to-CPW transition at D-band using wire bonding probe in a back-to-back configuration exhibits a bandwidth of 56.3 GHz ranging from 110 to 166.3 GHz in which the return loss is better than 10 dB with an associated insertion loss of 2 dB. Compared with the fabricated rectangular waveguide-to-CPW transition using E-plane probe, an equivalent bandwidth is achieved at D-band while the system packaging approaches are more versatile and compact for the proposed transition using wire bonding probe
Original languageEnglish
JournalJournal of Infrared, Millimeter and Terahertz Waves
Number of pages17
ISSN1866-6892
DOIs
Publication statusPublished - 2018

Keywords

  • Coplanar waveguide (CPW)
  • E-plane probe
  • Packaging
  • Rectangular waveguide
  • Wideband transition
  • Wire bonding probe

Cite this

@article{53f316d02955464ab29d37f0052e7e3e,
title = "A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe",
abstract = "This paper presents a rectangular waveguide-to-coplanar waveguide (CPW) transition at D-band (110–170 GHz) using wire bonding probe. A conventional CPW isdesigned and fabricated based on both quartz and glass substrates for estimating the losses at D-band and testing the fabrication processes. Two transition prototypes at D-band using E-plane probe and wire bonding probe are designed, fabricated, and measured in a back-to-back configuration. The system packaging approaches and scattering parameters of the transition prototypes are compared. For both on-chip and carrier substrate approaches, chips can be tested individually before packaged into a system and extra connections are not required. The fabricated rectangular waveguide-to-CPW transition at D-band using wire bonding probe in a back-to-back configuration exhibits a bandwidth of 56.3 GHz ranging from 110 to 166.3 GHz in which the return loss is better than 10 dB with an associated insertion loss of 2 dB. Compared with the fabricated rectangular waveguide-to-CPW transition using E-plane probe, an equivalent bandwidth is achieved at D-band while the system packaging approaches are more versatile and compact for the proposed transition using wire bonding probe",
keywords = "Coplanar waveguide (CPW), E-plane probe, Packaging, Rectangular waveguide, Wideband transition, Wire bonding probe",
author = "Yunfeng Dong and Vitaliy Zhurbenko and Hanberg, {Peter Jesper} and Johansen, {Tom Keinicke}",
year = "2018",
doi = "10.1007/s10762-018-0551-x",
language = "English",
journal = "Journal of Infrared, Millimeter and Terahertz Waves",
issn = "1866-6892",
publisher = "Springer New York",

}

TY - JOUR

T1 - A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe

AU - Dong, Yunfeng

AU - Zhurbenko, Vitaliy

AU - Hanberg, Peter Jesper

AU - Johansen, Tom Keinicke

PY - 2018

Y1 - 2018

N2 - This paper presents a rectangular waveguide-to-coplanar waveguide (CPW) transition at D-band (110–170 GHz) using wire bonding probe. A conventional CPW isdesigned and fabricated based on both quartz and glass substrates for estimating the losses at D-band and testing the fabrication processes. Two transition prototypes at D-band using E-plane probe and wire bonding probe are designed, fabricated, and measured in a back-to-back configuration. The system packaging approaches and scattering parameters of the transition prototypes are compared. For both on-chip and carrier substrate approaches, chips can be tested individually before packaged into a system and extra connections are not required. The fabricated rectangular waveguide-to-CPW transition at D-band using wire bonding probe in a back-to-back configuration exhibits a bandwidth of 56.3 GHz ranging from 110 to 166.3 GHz in which the return loss is better than 10 dB with an associated insertion loss of 2 dB. Compared with the fabricated rectangular waveguide-to-CPW transition using E-plane probe, an equivalent bandwidth is achieved at D-band while the system packaging approaches are more versatile and compact for the proposed transition using wire bonding probe

AB - This paper presents a rectangular waveguide-to-coplanar waveguide (CPW) transition at D-band (110–170 GHz) using wire bonding probe. A conventional CPW isdesigned and fabricated based on both quartz and glass substrates for estimating the losses at D-band and testing the fabrication processes. Two transition prototypes at D-band using E-plane probe and wire bonding probe are designed, fabricated, and measured in a back-to-back configuration. The system packaging approaches and scattering parameters of the transition prototypes are compared. For both on-chip and carrier substrate approaches, chips can be tested individually before packaged into a system and extra connections are not required. The fabricated rectangular waveguide-to-CPW transition at D-band using wire bonding probe in a back-to-back configuration exhibits a bandwidth of 56.3 GHz ranging from 110 to 166.3 GHz in which the return loss is better than 10 dB with an associated insertion loss of 2 dB. Compared with the fabricated rectangular waveguide-to-CPW transition using E-plane probe, an equivalent bandwidth is achieved at D-band while the system packaging approaches are more versatile and compact for the proposed transition using wire bonding probe

KW - Coplanar waveguide (CPW)

KW - E-plane probe

KW - Packaging

KW - Rectangular waveguide

KW - Wideband transition

KW - Wire bonding probe

U2 - 10.1007/s10762-018-0551-x

DO - 10.1007/s10762-018-0551-x

M3 - Journal article

JO - Journal of Infrared, Millimeter and Terahertz Waves

JF - Journal of Infrared, Millimeter and Terahertz Waves

SN - 1866-6892

ER -