A Compensated Finite-Ground Elevated Coplanar Waveguide Interconnect Strategy for InP Based Integrated Circuits Above 100 GHz

T. K. Johansen*, R. Hersent, V. Nodjiadjim, M. Riet, C. Mismer, B. Ardouin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

In this paper, a low-loss interconnect strategy for InP integrated circuits operating above 100 GHz is proposed. The interconnect strategy is based upon finite-ground elevated coplanar waveguide (FG-ECPW) structures and requires no through-substrate vias (TSVs) or backside processing. To minimize the reflection losses at the FG-ECPW discontinuities, the ground bridge parasitics are compensated leading to a seamless transmission characteristic through FG-ECPW structures such as Tee-junctions, bends and crosses. The compensated FG-ECPW interconnects have been implemented in a high-speed, mixed-signal InP DHBT technology from III-V Lab. A compensated FG-ECPW meandered line with an accumulated length of 1.65 mm shows a resonance free, single-mode transmission characteristic with an average insertion loss of 2.4 dB in the full D-band from 110-170 GHz. The measured improvement in insertion loss is 3.7 dB at 170 GHz over a similar noncompensated FG-ECPW meandered line.
Original languageEnglish
Title of host publicationProceedings of the 19th European Microwave Integrated Circuits Conference (EuMIC)
PublisherIEEE
Publication date2024
Pages98-101
ISBN (Electronic)978-2-87487-078-1
DOIs
Publication statusPublished - 2024
Event19th European Microwave Integrated Circuits Conference - Paris, France
Duration: 23 Sept 202424 Sept 2024

Conference

Conference19th European Microwave Integrated Circuits Conference
Country/TerritoryFrance
CityParis
Period23/09/202424/09/2024

Keywords

  • Coplanar waveguides
  • D-band
  • Millimeter-wave integrated circuits
  • InP

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