Abstract
In this paper, a low-loss interconnect strategy for InP integrated circuits operating above 100 GHz is proposed. The interconnect strategy is based upon finite-ground elevated coplanar waveguide (FG-ECPW) structures and requires no through-substrate vias (TSVs) or backside processing. To minimize the reflection losses at the FG-ECPW discontinuities, the ground bridge parasitics are compensated leading to a seamless transmission characteristic through FG-ECPW structures such as Tee-junctions, bends and crosses. The compensated FG-ECPW interconnects have been implemented in a high-speed, mixed-signal InP DHBT technology from III-V Lab. A compensated FG-ECPW meandered line with an accumulated length of 1.65 mm shows a resonance free, single-mode transmission characteristic with an average insertion loss of 2.4 dB in the full D-band from 110-170 GHz. The measured improvement in insertion loss is 3.7 dB at 170 GHz over a similar noncompensated FG-ECPW meandered line.
Original language | English |
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Title of host publication | Proceedings of the 19th European Microwave Integrated Circuits Conference (EuMIC) |
Publisher | IEEE |
Publication date | 2024 |
Pages | 98-101 |
ISBN (Electronic) | 978-2-87487-078-1 |
DOIs | |
Publication status | Published - 2024 |
Event | 19th European Microwave Integrated Circuits Conference - Paris, France Duration: 23 Sept 2024 → 24 Sept 2024 |
Conference
Conference | 19th European Microwave Integrated Circuits Conference |
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Country/Territory | France |
City | Paris |
Period | 23/09/2024 → 24/09/2024 |
Keywords
- Coplanar waveguides
- D-band
- Millimeter-wave integrated circuits
- InP