A 3D Hybrid Integration Methodology for Terabit Transceivers

Yunfeng Dong; Tom Keinicke Johansen; Vitaliy Zhurbenko; Antonio  Beretta; Antonello  Vannucci; Gianpietro  Locatelli

doi:10.1109/IMOC.2015.7369143

A 3D Hybrid Integration Methodology for Terabit Transceivers

Yunfeng Dong, Tom Keinicke Johansen, Vitaliy Zhurbenko, Antonio Beretta, Antonello Vannucci, Gianpietro Locatelli

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Abstract

This paper presents a three-dimensional (3D) hybrid integration methodology for terabit transceivers. The simulation methodology for multi-conductor structures are explained. The effect of ground vias on the RF circuitry and the preferred interposer substrate material for large bandwidth 3D hybrid integration are described. An equivalent circuit model of the via-throughs connecting the RF circuitry to the modulator is proposed and its lumped element parameters are extracted. Wire bonding transitions between the driving and RF circuitry were designed and simulated. An optimized 3D interposer design demonstrated a simulated -3 dB transmission bandwidth up to 95 GHz with associated return loss better than 10 dB. A thermal analysis of a subassembly for the packaged transmitter module is performed. A maximum temperature of 74 °C is predicted when copper-tungsten is used as the material of the sub-mount and heat sink layer.

Original language	English
Title of host publication	Proceedings. 2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)
Number of pages	5
Publisher	IEEE
Publication date	2015
ISBN (Print)	978-1-5090-0431-7
DOIs	https://doi.org/10.1109/IMOC.2015.7369143
Publication status	Published - 2015
Event	2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference - Porto de Galinhas, Brazil Duration: 3 Nov 2015 → 6 Nov 2015 https://ieeexplore.ieee.org/xpl/conhome/7363713/proceeding

Conference

Conference	2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference
Country/Territory	Brazil
City	Porto de Galinhas
Period	03/11/2015 → 06/11/2015
Internet address	https://ieeexplore.ieee.org/xpl/conhome/7363713/proceeding

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title = "A 3D Hybrid Integration Methodology for Terabit Transceivers",

abstract = "This paper presents a three-dimensional (3D) hybrid integration methodology for terabit transceivers. The simulation methodology for multi-conductor structures are explained. The effect of ground vias on the RF circuitry and the preferred interposer substrate material for large bandwidth 3D hybrid integration are described. An equivalent circuit model of the via-throughs connecting the RF circuitry to the modulator is proposed and its lumped element parameters are extracted. Wire bonding transitions between the driving and RF circuitry were designed and simulated. An optimized 3D interposer design demonstrated a simulated -3 dB transmission bandwidth up to 95 GHz with associated return loss better than 10 dB. A thermal analysis of a subassembly for the packaged transmitter module is performed. A maximum temperature of 74 °C is predicted when copper-tungsten is used as the material of the sub-mount and heat sink layer.",

author = "Yunfeng Dong and Johansen, {Tom Keinicke} and Vitaliy Zhurbenko and Antonio Beretta and Antonello Vannucci and Gianpietro Locatelli",

year = "2015",

doi = "10.1109/IMOC.2015.7369143",

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publisher = "IEEE",

address = "United States",

note = "2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference, IMOC 2015 ; Conference date: 03-11-2015 Through 06-11-2015",

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Dong, Y, Johansen, TK , Zhurbenko, V, Beretta, A, Vannucci, A & Locatelli, G 2015, A 3D Hybrid Integration Methodology for Terabit Transceivers. in Proceedings. 2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC). IEEE, 2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference, Porto de Galinhas, Brazil, 03/11/2015. https://doi.org/10.1109/IMOC.2015.7369143

TY - GEN

T1 - A 3D Hybrid Integration Methodology for Terabit Transceivers

AU - Dong, Yunfeng

AU - Johansen, Tom Keinicke

AU - Zhurbenko, Vitaliy

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AU - Vannucci, Antonello

AU - Locatelli, Gianpietro

PY - 2015

Y1 - 2015

N2 - This paper presents a three-dimensional (3D) hybrid integration methodology for terabit transceivers. The simulation methodology for multi-conductor structures are explained. The effect of ground vias on the RF circuitry and the preferred interposer substrate material for large bandwidth 3D hybrid integration are described. An equivalent circuit model of the via-throughs connecting the RF circuitry to the modulator is proposed and its lumped element parameters are extracted. Wire bonding transitions between the driving and RF circuitry were designed and simulated. An optimized 3D interposer design demonstrated a simulated -3 dB transmission bandwidth up to 95 GHz with associated return loss better than 10 dB. A thermal analysis of a subassembly for the packaged transmitter module is performed. A maximum temperature of 74 °C is predicted when copper-tungsten is used as the material of the sub-mount and heat sink layer.

AB - This paper presents a three-dimensional (3D) hybrid integration methodology for terabit transceivers. The simulation methodology for multi-conductor structures are explained. The effect of ground vias on the RF circuitry and the preferred interposer substrate material for large bandwidth 3D hybrid integration are described. An equivalent circuit model of the via-throughs connecting the RF circuitry to the modulator is proposed and its lumped element parameters are extracted. Wire bonding transitions between the driving and RF circuitry were designed and simulated. An optimized 3D interposer design demonstrated a simulated -3 dB transmission bandwidth up to 95 GHz with associated return loss better than 10 dB. A thermal analysis of a subassembly for the packaged transmitter module is performed. A maximum temperature of 74 °C is predicted when copper-tungsten is used as the material of the sub-mount and heat sink layer.

U2 - 10.1109/IMOC.2015.7369143

DO - 10.1109/IMOC.2015.7369143

M3 - Article in proceedings

SN - 978-1-5090-0431-7

BT - Proceedings. 2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)

PB - IEEE

T2 - 2015 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference

Y2 - 3 November 2015 through 6 November 2015

ER -

A 3D Hybrid Integration Methodology for Terabit Transceivers

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