3D thermal simulations and modeling of multi-finger InP DHBTs for millimeter-wave power amplifiers

Virginio Midili, V. Nodjiadjim, Tom Keinicke Johansen, M. Riet, Michele Squartecchia, J.Y. Dupuy, A. Konczykowska

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

This paper presents the comparison between the simulated and measured thermal resistance of InP Double Heterojunction Bipolar Transistors (DHBT). 3D thermal simulations were carried out in order to compute the temperature distribution across the full structure due to a constant power excitation of devices with up to 8 emitter fingers. The surface temperature profile was then used to compute the average thermal resistance of the multi-finger devices. The comparison with the corresponding results obtained by electrical measurements show a good agreement. The temperature profiles from several simulations are used to extract the thermal resistance matrix used in the electro-thermal coupling network of a compact large-signal model.
Original languageEnglish
Title of host publicationProceedings of Microwave and Optoelectronics Conference (IMOC), 2017 SBMO/IEEE MTT-S International
Number of pages5
PublisherIEEE
Publication date2017
Pages1-5
ISBN (Print)978-1-5090-6242-3
ISBN (Electronic)978-1-5090-6241-6
DOIs
Publication statusPublished - 2017
Event2017 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC) - Águas de Lindoia, Brazil
Duration: 27 Aug 201730 Aug 2017
https://www.imoc2017.com/

Conference

Conference2017 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)
CountryBrazil
CityÁguas de Lindoia
Period27/08/201730/08/2017
Internet address

Keywords

  • InP DHBT
  • Multifinger
  • Thermal simulations
  • Compact large-signal model
  • Millimeter-Wave
  • Power amplifiers

Fingerprint Dive into the research topics of '3D thermal simulations and modeling of multi-finger InP DHBTs for millimeter-wave power amplifiers'. Together they form a unique fingerprint.

Cite this