2k micro moulding for MID fabrication

Aminul Islam, Hans Nørgaard Hansen, Martin Bondo Jørgensen

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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Abstract

Molded Interconnect Devices (MIDs) are plastic substrates with electrical infrastructure. The fabrication of MIDs is usually based on injection molding and different process chains may be identified from this starting point. The use of MIDs has been driven primarily by the automotive sector, but recently the medical sector seems more and more interested. In particular, the possibility of miniaturization of 3D components with electrical infrastructure is attractive. The paper describes possible manufacturing routes and challenges of miniaturized MIDs based on two component injection molding and subsequent metallization. This technology promises cost-effective and convergent manufacturing approaches for both macro and micro applications. This paper presents the results of industrial MID production based on two component injection molding and discusses the important issues for MID production that can modulate the qualities of final MID. Results and discussion presented here can be a valuable used guide for mass production of molded interconnect devices.
Original languageEnglish
Title of host publicationPolymer Process Engineering 09 : PPE-Enhanced polymer processing
Number of pages419
Volume1
Place of PublicationBradford
PublisherUniversity of Bradford
Publication date2009
Edition1
Pages273-293
ISBN (Print)9781851432622
Publication statusPublished - 2009
EventConference of polymer process engineering - Bradford, The United Kingdom
Duration: 1 Jan 2009 → …

Conference

ConferenceConference of polymer process engineering
CityBradford, The United Kingdom
Period01/01/2009 → …

Keywords

  • Selective Metallization
  • Moulded Interconnect Devices
  • Two Component Injection Moulding

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