2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Thomas Lehrmann Christiansen; Christian Dahl-Petersen; Jørgen Arendt Jensen; Erik Vilain Thomsen

doi:10.1109/ULTSYM.2013.0436

2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Thomas Lehrmann Christiansen
, Christian Dahl-Petersen
, Jørgen Arendt Jensen
, Erik Vilain Thomsen

Technical University of Denmark

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.

Original language	English
Title of host publication	2013 IEEE International Ultrasonics Symposium Proceedings
Publisher	IEEE
Publication date	2013
Pages	1712-1715
ISBN (Print)	9781467356862
DOIs	https://doi.org/10.1109/ULTSYM.2013.0436
Publication status	Published - 2013
Event	2013 IEEE International Ultrasonics Symposium - Prague Convention Center , Prague, Czech Republic Duration: 21 Jul 2013 → 25 Jul 2013 http://ewh.ieee.org/conf/uffc/2013/

Conference

Conference	2013 IEEE International Ultrasonics Symposium
Location	Prague Convention Center
Country/Territory	Czech Republic
City	Prague
Period	21/07/2013 → 25/07/2013
Internet address	http://ewh.ieee.org/conf/uffc/2013/

Keywords

Fields, Waves and Electromagnetics
Bonding
Electrodes
Insulation
Resonant frequency
Silicon-on-insulator
Voltage measurement

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10.1109/ULTSYM.2013.0436

Preprint OpenGridSubmitted manuscript, 26.1 MB

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title = "2-D Row-Column CMUT Arrays with an Open-Grid Support Structure",

abstract = "Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.",

keywords = "Fields, Waves and Electromagnetics, Bonding, Electrodes, Insulation, Resonant frequency, Silicon-on-insulator, Voltage measurement",

author = "Christiansen, \{Thomas Lehrmann\} and Christian Dahl-Petersen and Jensen, \{J{\o}rgen Arendt\} and Thomsen, \{Erik Vilain\}",

year = "2013",

doi = "10.1109/ULTSYM.2013.0436",

language = "English",

isbn = "9781467356862",

pages = "1712--1715",

booktitle = "2013 IEEE International Ultrasonics Symposium Proceedings",

publisher = "IEEE",

address = "United States",

note = "2013 IEEE International Ultrasonics Symposium, IUS 2013 ; Conference date: 21-07-2013 Through 25-07-2013",

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T1 - 2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

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AU - Dahl-Petersen, Christian

AU - Jensen, Jørgen Arendt

AU - Thomsen, Erik Vilain

PY - 2013

Y1 - 2013

N2 - Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.

AB - Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.

KW - Fields, Waves and Electromagnetics

KW - Bonding

KW - Electrodes

KW - Insulation

KW - Resonant frequency

KW - Silicon-on-insulator

KW - Voltage measurement

U2 - 10.1109/ULTSYM.2013.0436

DO - 10.1109/ULTSYM.2013.0436

M3 - Article in proceedings

SN - 9781467356862

SP - 1712

EP - 1715

BT - 2013 IEEE International Ultrasonics Symposium Proceedings

PB - IEEE

T2 - 2013 IEEE International Ultrasonics Symposium

Y2 - 21 July 2013 through 25 July 2013

ER -

2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

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Conference

Keywords

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