2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Thomas Lehrmann Christiansen, Christian Dahl-Petersen, Jørgen Arendt Jensen, Erik Vilain Thomsen

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Abstract

Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.
Original languageEnglish
Title of host publication2013 IEEE International Ultrasonics Symposium Proceedings
PublisherIEEE
Publication date2013
Pages1712-1715
ISBN (Print)9781467356862
DOIs
Publication statusPublished - 2013
Event2013 IEEE International Ultrasonics Symposium - Prague Convention Center , Prague, Czech Republic
Duration: 21 Jul 201325 Jul 2013
http://ewh.ieee.org/conf/uffc/2013/

Conference

Conference2013 IEEE International Ultrasonics Symposium
LocationPrague Convention Center
CountryCzech Republic
CityPrague
Period21/07/201325/07/2013
Internet address

Keywords

  • Fields, Waves and Electromagnetics
  • Bonding
  • Electrodes
  • Insulation
  • Resonant frequency
  • Silicon-on-insulator
  • Voltage measurement

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