2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Thomas Lehrmann Christiansen; Christian Dahl-Petersen; Jørgen Arendt Jensen; Erik Vilain Thomsen

doi:10.1109/ULTSYM.2013.0436

2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Thomas Lehrmann Christiansen, Christian Dahl-Petersen, Jørgen Arendt Jensen, Erik Vilain Thomsen

Technical University of Denmark

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.

Original language	English
Title of host publication	2013 IEEE International Ultrasonics Symposium Proceedings
Publisher	IEEE
Publication date	2013
Pages	1712-1715
ISBN (Print)	9781467356862
DOIs	https://doi.org/10.1109/ULTSYM.2013.0436
Publication status	Published - 2013
Event	2013 IEEE International Ultrasonics Symposium - Prague Convention Center , Prague, Czech Republic Duration: 21 Jul 2013 → 25 Jul 2013 http://ewh.ieee.org/conf/uffc/2013/

Conference

Conference	2013 IEEE International Ultrasonics Symposium
Location	Prague Convention Center
Country/Territory	Czech Republic
City	Prague
Period	21/07/2013 → 25/07/2013
Internet address	http://ewh.ieee.org/conf/uffc/2013/

Keywords

Fields, Waves and Electromagnetics
Bonding
Electrodes
Insulation
Resonant frequency
Silicon-on-insulator
Voltage measurement

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10.1109/ULTSYM.2013.0436

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abstract = "Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.",

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KW - Electrodes

KW - Insulation

KW - Resonant frequency

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KW - Voltage measurement

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M3 - Article in proceedings

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ER -

2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

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Conference

Keywords

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