188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

Rune Sixten Grass; Andreas Spandet Havreland; Mathias Engholm; Jørgen Arendt Jensen; Erik Vilain Thomsen

doi:10.1109/ULTSYM.2019.8925940

188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

Rune Sixten Grass, Andreas Spandet Havreland, Mathias Engholm, Jørgen Arendt Jensen, Erik Vilain Thomsen

Department of Health Technology

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.

Original language	English
Title of host publication	Proceedings of the IEEE International Ultrasonic Symposium 2019
Publisher	IEEE
Publication date	2019
Pages	746-749
ISBN (Electronic)	978-1-7281-4596-9
DOIs	https://doi.org/10.1109/ULTSYM.2019.8925940
Publication status	Published - 2019
Event	2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom Duration: 6 Oct 2019 → 9 Oct 2019 http://attend.ieee.org/ius-2019/

Conference

Conference	2019 IEEE International Ultrasonics Symposium
Location	SEC Glasgow
Country/Territory	United Kingdom
City	Glasgow
Period	06/10/2019 → 09/10/2019
Internet address	http://attend.ieee.org/ius-2019/

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10.1109/ULTSYM.2019.8925940

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188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging
Grass, R. S. (Speaker)
7 Oct 2019
Activity: Talks and presentations › Conference presentations

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2019 IEEE International Ultrasonics Symposium
Grass, R. S. (Participant)
6 Oct 2019 → 9 Oct 2019
Activity: Attending an event › Participating in or organising a conference

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Cite this

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title = "188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging",

abstract = "A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8\% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.",

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doi = "10.1109/ULTSYM.2019.8925940",

language = "English",

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booktitle = "Proceedings of the IEEE International Ultrasonic Symposium 2019",

publisher = "IEEE",

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AB - A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.

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188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

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188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

2019 IEEE International Ultrasonics Symposium

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