188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

49 Downloads (Pure)

Abstract

A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.
Original languageEnglish
Title of host publicationProceedings of the IEEE International Ultrasonic Symposium 2019
PublisherIEEE
Publication date2019
Pages746-749
ISBN (Electronic)978-1-7281-4596-9
DOIs
Publication statusPublished - 2019
Event2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019
http://attend.ieee.org/ius-2019/

Conference

Conference2019 IEEE International Ultrasonics Symposium
LocationSEC Glasgow
CountryUnited Kingdom
CityGlasgow
Period06/10/201909/10/2019
Internet address

Cite this

@inproceedings{1fdac5401f7c461fa762b25a46693ba2,
title = "188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging",
abstract = "A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8{\%} for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.",
author = "Grass, {Rune Sixten} and Havreland, {Andreas Spandet} and Mathias Engholm and Jensen, {J{\o}rgen Arendt} and Thomsen, {Erik Vilain}",
year = "2019",
doi = "10.1109/ULTSYM.2019.8925940",
language = "English",
pages = "746--749",
booktitle = "Proceedings of the IEEE International Ultrasonic Symposium 2019",
publisher = "IEEE",
address = "United States",

}

Grass, RS, Havreland, AS, Engholm, M, Jensen, JA & Thomsen, EV 2019, 188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging. in Proceedings of the IEEE International Ultrasonic Symposium 2019. IEEE, pp. 746-749, 2019 IEEE International Ultrasonics Symposium, Glasgow, United Kingdom, 06/10/2019. https://doi.org/10.1109/ULTSYM.2019.8925940

188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging. / Grass, Rune Sixten; Havreland, Andreas Spandet; Engholm, Mathias; Jensen, Jørgen Arendt; Thomsen, Erik Vilain.

Proceedings of the IEEE International Ultrasonic Symposium 2019. IEEE, 2019. p. 746-749.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

TY - GEN

T1 - 188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

AU - Grass, Rune Sixten

AU - Havreland, Andreas Spandet

AU - Engholm, Mathias

AU - Jensen, Jørgen Arendt

AU - Thomsen, Erik Vilain

PY - 2019

Y1 - 2019

N2 - A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.

AB - A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.

U2 - 10.1109/ULTSYM.2019.8925940

DO - 10.1109/ULTSYM.2019.8925940

M3 - Article in proceedings

SP - 746

EP - 749

BT - Proceedings of the IEEE International Ultrasonic Symposium 2019

PB - IEEE

ER -