Abstract
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the IEEE International Ultrasonic Symposium 2019 |
| Publisher | IEEE |
| Publication date | 2019 |
| Pages | 746-749 |
| ISBN (Electronic) | 978-1-7281-4596-9 |
| DOIs | |
| Publication status | Published - 2019 |
| Event | 2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom Duration: 6 Oct 2019 → 9 Oct 2019 http://attend.ieee.org/ius-2019/ |
Conference
| Conference | 2019 IEEE International Ultrasonics Symposium |
|---|---|
| Location | SEC Glasgow |
| Country | United Kingdom |
| City | Glasgow |
| Period | 06/10/2019 → 09/10/2019 |
| Internet address |
Cite this
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188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging. / Grass, Rune Sixten; Havreland, Andreas Spandet; Engholm, Mathias; Jensen, Jørgen Arendt; Thomsen, Erik Vilain.
Proceedings of the IEEE International Ultrasonic Symposium 2019. IEEE, 2019. p. 746-749.Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review
TY - GEN
T1 - 188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging
AU - Grass, Rune Sixten
AU - Havreland, Andreas Spandet
AU - Engholm, Mathias
AU - Jensen, Jørgen Arendt
AU - Thomsen, Erik Vilain
PY - 2019
Y1 - 2019
N2 - A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.
AB - A capacitive micromachined ultrasonic transducer (CMUT), 8 MHz resonance frequency, λ/2 cell pitch 188+188 row-column addressed (RCA) array for super resolution imaging is presented. The top- and bottom electrode design features a zig-zag shaped pattern to increase the active cell area for fixed plate thicknesses. The RCA CMUT has been fabricated utilising a deposit, remove, etch, multistep (DREM) process to fully separate the bottom electrodes electrically as well as anodic bonding the array to an insulating borosilicate glass wafer. Linear test elements have been characterized. Electrical measurements show a center frequency of approximately 5.5 MHz and a coupling coefficient of 7.8% for -80 V DC bias and 50 mV AC. Acoustic measurements made in immersion with a single cycle 4 MHz pulse with a -90 V DC bias demonstrate that the fabricated CMUT arrays can emit broadband ultrasound pulses.
U2 - 10.1109/ULTSYM.2019.8925940
DO - 10.1109/ULTSYM.2019.8925940
M3 - Article in proceedings
SP - 746
EP - 749
BT - Proceedings of the IEEE International Ultrasonic Symposium 2019
PB - IEEE
ER -