Σ=3 grain boundaries in Cu-Ni subjected to diffusional creep

T. Nørbygaard, Jørgen Bilde-Sørensen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationCreep and fracture of engineering materials and structures. Proceedings
    EditorsJ.D. Parker
    Place of PublicationLondon
    PublisherInstitute of Materials
    Publication date2001
    Pages15-20
    ISBN (Print)1-86125-144-0
    Publication statusPublished - 2001
    Event9. International conference - Swansea (GB), 1-4 Apr
    Duration: 1 Jan 2001 → …

    Conference

    Conference9. International conference
    CitySwansea (GB), 1-4 Apr
    Period01/01/2001 → …

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