The objective is to develop a generic concept for integrating high-performance ASICs with transducer functions, such as sensing sound and dispensing ink. The focus will be on stacking of silicon chips much like a multi-chip module (MCM) known from memory and telecommunication devices. The advantages of such a system are its minimum volume, which is important for a space-constrained system, and its high level of integration allowing the electronics to be close to the action in a smart system. For this, stacking technologies are developed,including electrical connections through wafers, and fluxless solder bump bonding on waferscale. The concept provides, furthermore, the possibility to combine different technologies and to protect the system more efficiently against harsh environmental conditions.
|Effective start/end date||01/11/1997 → 01/05/2000|
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.