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Nanostructuring with Bonding
Poulsen, Mette
(PhD Student)
Jensen, Flemming
(Main Supervisor)
Thomsen, Erik Vilain
(Examiner)
David, Christian
(Examiner)
Reus, Roger De
(Examiner)
Feidenhans'l, Robert
(Supervisor)
Overview
Fingerprint
Publications
(1)
Project Details
Status
Finished
Effective start/end date
01/05/2001
→
15/06/2006
Funding
Risø (Løn)
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Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
Wafer Bonding
Engineering
100%
Bond Strength
Engineering
100%
Mechanical Strength
Material Science
100%
Waveguide
Engineering
80%
Reactive Ion Etch
Engineering
60%
Low-Temperature
Engineering
60%
Temperature Plasma
Engineering
40%
Silicon Wafer
Engineering
40%
Research output
Publications per year
2006
2006
2006
1
Ph.D. thesis
Publications per year
Publications per year
Nanostructuring with Bonding and Structural Studies of Plasma Assisted Wafer Bonding
Poulsen, M.,
Jun 2006
, Kgs. Lyngby:
Technical University of Denmark
.
175 p.
Research output
:
Book/Report
›
Ph.D. thesis
File
Wafer Bonding
100%
Bond Strength
100%
Mechanical Strength
100%
Waveguide
80%
Low-Temperature
60%
436
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