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Modelling of Solidification and Interdiffusion in Lead Free Solder Materials
Nachiappan, Vivek Chidambaram
(PhD Student)
Hattel, Jesper Henri
(Main Supervisor)
Hald, John
(Supervisor)
Kodentsov, Alexsander
(Examiner)
Fredriksson, Hasse
(Examiner)
Leisner, Peter
(Examiner)
Overview
Fingerprint
Publications
(1)
Project Details
Status
Finished
Effective start/end date
01/09/2007
→
29/09/2010
Funding
Forskningsrådsfinansiering
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High-temperature Soldering
Keyphrases
100%
Lead-Free Solder
Material Science
100%
Electronic Packaging
Keyphrases
50%
Soft Solder
Keyphrases
50%
Soldering
Material Science
50%
Research output
Publications per year
2010
2010
2010
1
Ph.D. thesis
Publications per year
Publications per year
Development of lead-free solders for high-temperature applications
Chidambaram, V.,
Sept 2010
, Kgs. Lyngby, Denmark:
Technical University of Denmark
.
92 p.
Research output
:
Book/Report
›
Ph.D. thesis
File
High-temperature Soldering
100%
Lead-Free Solder
100%
Electronic Packaging
50%
Soft Solder
50%
Soldering
50%
2215
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