Engineering
Relative Humidity
100%
Numerical Modeling
100%
Computational Fluid Dynamics
55%
Ambient Condition
55%
Simulation Result
33%
Heatsinks
33%
Printed Circuit Board
33%
Moisture Transfer
33%
Natural Convection
33%
Energy Engineering
22%
Longer Term
22%
Circuit Model
11%
Good Agreement
11%
Finite Element Method
11%
Enclosure Boundary
11%
Thermal Energy
11%
Thermal Loads
11%
Air Flow
11%
Temperature Profile
11%
Temperature Increase
11%
Dynamic Models
11%
Internals
11%
Opening Size
11%
Initial Moisture Content
11%
Thermal Cycle
11%
Hole Bottom
11%
Convection Heat Transfer Coefficient
11%
Diffusion Coefficient
11%
Humidity Change
11%
Constant Time
11%
Design Phase
11%
Electronics Industry
11%
Operating Environment
11%
Dynamic Nature
11%
Operational Condition
11%
Outdoor Condition
11%
Boundary Condition
11%
Material Science
Computational Fluid Dynamics
100%
Electronic Circuit
80%
Capacitor
80%
Natural Convection
60%
Finite Element Methods
20%
Diffusivity
20%
Thermal Loads
20%
Chemical Engineering
Natural Convection
100%
Diffusion
33%
Heat Conduction
33%
Heat Transfer Coefficient
33%
Thermal Load
33%
Heat Convection
33%