Microsystems packaging

  • Bouwstra, Siebe (Project Manager)
  • Christensen, Carsten (Project Participant)
  • Petersen, Jon Wulff (Project Participant)
  • Henke, Sascha (Project Participant)
  • Kuhmann, Jochen Friedrich (Project Participant)
  • Heschel, Matthias (Project Participant)
  • Reus, Roger De (Project Participant)
  • Pedersen, Eddie Hjelm (Project Participant)
  • Weichel, Steen (Project Participant)
  • Romedahl, Tina (Project Manager)
  • Dyrbye, Karsten (Project Participant)
  • Janting, Jakob (Project Participant)
  • Gravesen, Peter (Project Participant)
  • Søndergaard, Ole (Project Participant)
  • Krogh, Jens Peter (Project Participant)
  • Birkelund, Karen (Project Participant)

    Project Details

    Description

    The purpose of the project, which is supported by he MUPII frame program "Advanced Packaging" and the centerkontract "Microsystem Centre", is to develop technology for advanced packaging of silicon transducers applied in hostile media. This is of paramount importance in many applications of these transducers. We follow the approach of doing as much as possible of the packaging on a wafer-scale, so that the dicing and the more expensive handling of individual chips is pushed further down the process sequence. The technologies will also lead to a modular but wafer-scale approach of integration of different functions, in particular the integration of transducers and circuits. Thin film materials are developed and tested for their passivation capabilities, such as silicon carbide, diamond-like-carbon, diffusion barrier alloys. These materials are required to be chemically resistant to the media, to form a dissusion barrier, and have to be pinhole free. They also have to be a window which is transparant for the desired interaction with the environment. Preliminary experimental results are promising. Also, technologies are developed for wafer-scale bonding to interface substrates, which form the physical interface to the measurand (e.g. a pressure port), or the communication interface to a host system (e.g. circuit for signal conditioning). The project involves two demonstrators: a pressure sensor exposed to aggressive media, and a microphone for hearingaids. Technologies are developed for electrical interconnections between the wafers, hermetic sealing with electrical feedthroughs, and for lithography in deep anisotropically etched holes in silicon. Current investigations include eutectic bonding using a metal thin film, anodic bonding using a glass thin film, and electrophoresis for photolithography in deep holes. Methods for accelerated testing of passivation and with high sensitivities are developed, as well as methods for determining sealing capabilities.
    StatusFinished
    Effective start/end date01/10/199401/10/1999

    Collaborative partners

    Funding

    • Unknown

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