Laser Microfabrication for fast prototyping

  • Bouwstra, Siebe (Project Manager)
  • Dirac, Paul Andreas Holger (Project Participant)
  • Jonsmann, Jacques (Project Participant)
  • Larsen, Ulrik Darling (Project Participant)
  • Heschel, Matthias (Project Participant)
  • Petersen, Jon Wulff (Project Participant)
  • Müllenborn, Matthias (Project Participant)
  • Petersen, Christian Leth (Project Participant)
  • Kuhn, Oliver (Project Participant)

    Project Details

    Description

    The laser direct-write system is based on a 20 W Ar-ion laser, on-axis optics, A/O beam modulation, and precision stages. The system is interfaced to a commercial 3-D CAD program by in-house developed software. Investigated applications of the system include photoresist exposure, membrane cutting, via hole etching, and the generation of truly 3-D structures such as microoptic and microfluidic components. 3-D structures are produced by sectioning CAD generated objects and subsequent layer-by-layer removal. to ensure writing uniformity and to reduce writing time, the system works on the fly, so that stage acceleration and deceleration is performed before and after writing, respectively.
    The main effort has been put into the application of the etching of silicon by chlorine, which is initiated by locally melting the silicon substrate with a focued laser beam. The removal rate is as high as 105 mm3/s and sub-micrometer resolution has been demonstrated. 3-D structures, generated by CAD, have been etched with resolutions ranging from 0.5 to 8 mm. Examples are microlens arrays for photonic devices and diffuser/nozzle elements for valve-less pumps in microfluidic systems.
    Post-processing on prepatterned substrates, e.g. in deep holes, 3-D machining, and the short turn-around time between device design and realization, have demonstrated the unique capabilities of laser microfabrication in prototype processing. The application of laser-machined 3-D structures in the production of molds and stamps for replication, is another promising field to be investigated.
    StatusFinished
    Effective start/end date01/07/199331/12/1998

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