Network

Kenji Watanabe

  • National Institute for Materials Science Tsukuba
  • National Institute for Materials Science

External person

James Hone

  • Columbia University

External person

Da Luo

  • Sungkyunkwan University
  • Institute for Basic Science

External person

Rodney S. Ruoff

  • Sungkyunkwan University
  • Ulsan National Institute of Science and Technology
  • Institute for Basic Science

External person

Wlodek Strupinski

  • Warsaw University of Technology
  • VIGO System S.A.

External person

Takashi Taniguchi

  • National Institute for Materials Science
  • National Institute for Materials Science Tsukuba

External person

Haofei Shi

  • Chinese Academy of Sciences

External person

Iwona Pasternak

  • Warsaw University of Technology
  • VIGO System S.A.

External person

Meihui Wang

  • Ulsan National Institute of Science and Technology
  • Institute for Basic Science

External person

Stephan Hofmann

  • University of Cambridge

External person

Marco Bianchi

  • Aarhus University

External person

Philip Hofmann

  • Aarhus University

External person

Niclas Lindvall

  • Chalmers University of Technology

External person

Deping Huang

  • Chinese Academy of Sciences

External person

Frank Balzer

  • University of Southern Denmark

External person

Yuqian Gu

  • University of Texas at Austin

External person

Frances M. Ross

  • IBM Research
  • Massachusetts Institute of Technology

External person

Chao Wang

  • University of Illinois at Urbana-Champaign

External person

Johan Liu

  • Chalmers University of Technology

External person

Jianfang Wang

  • Chinese University of Hong Kong

External person

Sergejs Boroviks

  • University of Southern Denmark
  • Swiss Federal Institute of Technology Lausanne

External person

Volkmar Eicchorn

  • University of Oldenburg

External person

Ruizhi Wang

  • University of Cambridge

External person

Cunzhi Sun

  • Technical University of Denmark

External person

Ismo K. Koponen

  • National Research Centre for the Working Environment

External person

P F Nielsen

  • CAPRES A/S

External person

S. Rubini

  • TASC National Laboratory

External person

Saverio Russo

  • University of Exeter

External person

Philipp Braeuninger-Weimer

  • University of Cambridge

External person

Abhay Shivayogimath

  • Peking University

External person

Kostya S. Novoselov

  • University of Manchester

External person

Lei Wang

  • The University of Electro-Communications
  • Northwestern University
  • Chinese Academy of Sciences

External person

Christian Wolff

  • University of Southern Denmark

External person

Pierre Seneor

  • Université Paris-Saclay

External person

Olga Kazakova

  • National Physical Laboratory

External person

Monica Felicia Craciun

  • University of Exeter

External person

Zdenka O. Kyjovska

  • National Research Centre for the Working Environment

External person

Camilla Coletti

  • Italian Institute of Technology

External person

Xiaohan Wu

  • University of Texas at Austin

External person

Hong Yan

  • Jülich Research Centre

External person

Nicklas R. Jacobsen

  • National Research Centre for the Working Environment

External person

Jie Sun

  • Chalmers University of Technology

External person

Cedric Huyghebaert

  • Interuniversitair Micro-Elektronica Centrum

External person

Saskia Fiedler

  • University of Southern Denmark
  • AMOLF

External person

Mhairi H. Gass

  • Daresbury Laboratory

External person

Mohammad Hossein Tarokh

  • Copenhagen Nanosystems ApS

External person

R Lin

  • CAPRES A/S

External person

Yanfeng Zhang

  • Peking University
  • Sun Yat-Sen University

External person

M. I. Katsnelson

  • Radboud University Nijmegen

External person

Jürgen Parisi

  • University of Oldenburg
  • University of Oxford

External person

Stiven Forti

  • Italian Institute of Technology
  • National Research Council of Italy

External person

Martin Thomaschewski

  • University of Southern Denmark
  • George Washington University

External person

Thomas Tølbøl Sørensen

  • Copenhagen Nanosystems ApS

External person

Cunzhi Sun

  • Xiamen University

External person

Matthew T. Cole

  • University of Cambridge

External person

Vladimir Antonov

  • Royal Holloway University of London
  • Skolkovo Institute of Science and Technology

External person

N. M. R. Peres

  • University of Minho

External person

Morten Møller

  • Technical University of Denmark

External person

Vishal Panchal

  • National Physical Laboratory

External person

Andrew L. Bleloch

  • Daresbury Laboratory

External person

Lutz Prager

  • Leibniz-Institut für Oberflächenmodifizierung e.V.

External person

Gui Yu

  • Chinese Academy of Sciences

External person

Kenneth B K Teo

  • AIXTRON
  • Aixtron SE

External person

David B. Geohegan

  • Oak Ridge National Laboratory

External person

Steven Brems

  • Interuniversitair Micro-Elektronica Centrum

External person

Bjarke S. Jessen

  • Columbia University

External person

Mark C. Reuter

  • University of Illinois at Urbana-Champaign

External person

Peter T. Tang

  • Institute for Product Development

External person

Jianping Shi

  • Peking University

External person

Feng Zhang

  • University of Science and Technology of China
  • Shandong University
  • Xiamen University

External person

Takashi Tanaguchi

  • National Institute for Materials Science Tsukuba

External person

Michael Hilke

  • McGill University
  • University of Florence

External person

Manuela Schiek

  • University of Oldenburg

External person

Carsten Gade

  • Technical University of Denmark

External person

Rong Sun

  • University of Southern Denmark

External person

Emmanuel Okogbue

  • University of Central Florida

External person

Lars Eriksson

  • Stockholm University

External person

Raymond Unocic

  • Oak Ridge National Laboratory

External person

Teng Wang

  • Chalmers University of Technology

External person

Tom Vincent

  • National Physical Laboratory
  • Royal Holloway University of London

External person

A Löwenborg

  • Technical University of Denmark

External person

Ben R. Conran

  • Aixtron SE

External person

August Yurgens

  • Chalmers University of Technology

External person

Eric Whiteway

  • McGill University

External person

Ruijing Ge

  • University of Texas at Austin

External person

Deji Akinwande

  • University of Texas at Austin

External person

Yeonwoong Jung

  • University of Texas at Austin

External person

Jack C. Lee

  • University of Texas at Austin

External person

Nick W. Petrone

  • Columbia University

External person

Sanjoy K. Mahatha

  • Aarhus University
  • German Electron Synchrotron

External person

Emil Højlund-Nielsen

  • Copenhagen Nanosystems ApS

External person

Trine Berthing

  • National Research Centre for the Working Environment

External person

Marc Chaigneau

  • HORIBA Scientific

External person

Neeraj Mishra

  • Italian Institute of Technology

External person

Qian Shen

  • Nanchang University
  • Technical University of Denmark
  • Zhejiang University of Technology

External person

Paul A. Midgley

  • University of Cambridge

External person

Bruno Dlubak

  • Université Paris-Saclay

External person

Rongdun Hong

  • Xiamen University

External person

S. Ambrosini

  • University of Trieste

External person

Sergii Morozov

  • University of Southern Denmark
  • Technical University of Denmark

External person