• Produktionstorvet, 425, 114

    2800 Kgs. Lyngby

    Denmark

1990 …2022
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Research Output 1990 2020

2020

An electrochemical and X-ray computed tomography investigation of the effect of temperature on CO2 corrosion of 1Cr carbon steel

Rizzo, R., Baier, S., Rogowska, M. & Ambat, R., 2020, (Accepted/In press) In : Corrosion science. 108471.

Research output: Contribution to journalJournal articleResearchpeer-review

Corrosion of carbon steel under CO2 conditions: Effect of CaCO3 precipitation on the stability of the FeCO3 protective layer

Rizzo, R., Gupta, S., Rogowska, M. & Ambat, R., 2020, In : Corrosion science. 162, 12 p., 108214.

Research output: Contribution to journalJournal articleResearchpeer-review

Humidity Robustness of Plasma-Coated PCBs

Khangholi, A., Li, F., Piotrowska, K., Loulidi, S., Ambat, R., Van Assche, G., Hubin, A. & De Graeve, I., 2020, In : Journal of Electronic Materials. 49, 1, p. 848-860

Research output: Contribution to journalJournal articleResearchpeer-review

On the microstructural and electrochemical nature of hydrothermally treated Al-Zr and Al-Ti surfaces

Tan, J., Crosio, M., Vinkel, N. M., Jensen, P., Abrahami, S. T., Gudla, V. C. & Ambat, R., 2020, In : Corrosion science. 163, 13 p., 108244.

Research output: Contribution to journalJournal articleResearchpeer-review

2019

Characterization of blisters on powder coated aluminium AA5006 architectural profiles

Zaffaroni, G. G. B., Gudla, V. C., Ud Din, R. & Ambat, R., 2019, In : Engineering Failure Analysis. 103, p. 347-360

Research output: Contribution to journalJournal articleResearchpeer-review

1 Downloads (Pure)

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, S., Verdingovas, V., Jellesen, M. S. & Ambat, R., 2019, In : Microelectronics Reliability. 93, p. 81-88

Research output: Contribution to journalJournal articleResearchpeer-review

Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads

Lauser, S., Richter, T., Verdingovas, V. & Ambat, R., 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, p. 515-21 (2019 Ieee 69th Electronic Components and Technology Conference (ectc). Proceedings).

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Graphene nanoclusters embedded nickel cobaltite nanofibers as multifunctional electrocatalyst for glucose sensing and water-splitting applications

Kumar, B. S., Gudla, V. C., Ambat, R., Kalpathy, S. K. & Anandhan, S., 2019, In : Ceramics International. 45, 18, Part B, p. 25078-25091

Research output: Contribution to journalJournal articleResearchpeer-review

1 Downloads (Pure)

High frequency pulse anodising of aluminium: Anodising kinetics and optical appearance

Jensen, F., Gudla, V. C., Kongstad, I. & Ambat, R., 2019, In : Surface and Coatings Technology. 360, p. 222-231

Research output: Contribution to journalJournal articleResearchpeer-review

High frequency pulse anodising of recycled 5006 aluminium alloy for optimised decorative appearance

Jensen, F., Kongstad, I., Dirscherl, K., Gudla, V. C. & Ambat, R., 2019, In : Surface and Coatings Technology. 368, p. 42-50

Research output: Contribution to journalJournal articleResearchpeer-review

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, K., Lagana, S., Jellesen, M. S. & Ambat, R., 2019, Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019. IEEE, 8 p.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Impact of Process-Related Flux Contamination on the Electronics Reliability Issus Under Detrimental Climatic Conditions

Piotrowska, K., Lagana, S., Jellesen, M. S. & Ambat, R., 2019, Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019. IEEE, 8 p.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Multipronged characterization of scales and corrosion on L80 steel in the presence of microorganism

Yang, Y., Rizzo, R., Ambat, R. & Rogowska, M., 2019, Proceedings of the Corrosion Conference and Expo 2019. NACE International, 12 p. 13226. (NACE - International Corrosion Conference Series).

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

1 Downloads (Pure)

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics

Piotrowska, K., Grzelak, M. & Ambat, R., 2019, In : Journal of Electronic Materials. 48, 2, p. 1207-1222

Research output: Contribution to journalJournal articleResearchpeer-review

Polymorph nickel titanate nanofibers as bifunctional electrocatalysts towards hydrogen and oxygen evolution reactions

Kumar, B. S., Tarafder, K., Shetty, A. R., Hegde, A. C., Gudla, V. C., Ambat, R., Kalpathy, S. K. & Anandhan, S., 2019, In : Dalton Transactions. 48, p. 12684-12698

Research output: Contribution to journalJournal articleResearchpeer-review

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, K., Li, F. & Ambat, R., 2019, (Accepted/In press) In : Soldering & Surface Mount Technology.

Research output: Contribution to journalJournal articleResearchpeer-review

2018

A Mechanistic Study on the Structure Formation of NiCo2O4 Nanofibers Decorated with In Situ Formed Graphene-Like Structures

Kumar, S., Gudla, V. C., Ambat, R., Kalpathy, S. K. & Anandhan, S., 2018, In : Journal of Inorganic and Organometallic Polymers. 28, 5, p. 1885-1900

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access

Characteristics and formation-growth model of corrosion scales in oil wellbore

Yang, Y., Yadav, A. & Ambat, R., 2018, European Corrosion Congress (EUROCORR 2018) . Polish Corrosion Society, p. 115-125

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, F., Verdingovas, V., Dirscherl, K., Medgyes, B. & Ambat, R., 2018, Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) . IEEE, p. 67-71

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, K., Din, R. U., Jellesen, M. S. & Ambat, R., 2018, In : I E E E Transactions on Components, Packaging and Manufacturing Technology. 8, 10, p. 1756-1768

Research output: Contribution to journalJournal articleResearchpeer-review

12 Downloads (Pure)

Electrochemical profiling of multi-clad aluminium sheets used in automotive heat exchangers

Bordo, K., C. Gudla, V., Peguet, L., Afseth, A. & Ambat, R., 2018, In : Corrosion science. 131, p. 28-37

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
10 Downloads (Pure)

Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings

Conseil-Gudla, H., Hamm, G., Mueller, L., Hain, M. & Ambat, R., 2018, In : I E E E Transactions on Components, Packaging and Manufacturing Technology. 8, 11, p. 1928-1937

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
5 Downloads (Pure)

Fluoride-Induced Interfacial Adhesion Loss of Nanoporous Anodic Aluminum Oxide Templates in Aerospace Structures

Abrahami, S. T., de Kok, J. M. M., Gudla, V. C., Marcoen, K., Hauffman, T., Ambat, R., Mol, J. M. C. & Terryn, H., 2018, In : ACS Applied Nano Materials . 1, 11, p. 6139-6149

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
Open Access
File

Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators

Piotrowska, K., Verdingovas, V. & Ambat, R., 2018, In : Journal of Materials Science: Materials in Electronics. 29, 20, p. 17834-17852

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
156 Downloads (Pure)

Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs

Lauser, S., Eckold, P., Richter, T., Verdingovas, V. & Ambat, R., 2018. 10 p.

Research output: Contribution to conferencePaperResearchpeer-review

Open Access
File
1 Downloads (Pure)

Influence of de-icing salt chemistry on the corrosion behavior of AA6016

Schoukens, I., Cavezza, F., Cerezo, J., Vandenberghe, V., Gudla, V. C. & Ambat, R., 2018, In : Materials and Corrosion. 69, 7, p. 881-887

Research output: Contribution to journalJournal articleResearchpeer-review

Microstructure and Corrosion Behavior of Extruded Mg-Zn-Er Alloys

Bhat Panemangalore, D., Shabadi, R., Gupta, M., Ambat, R., Ji, G., Addad, A. & Lesven, L., 2018, In : Materials Science Forum. 941, p. 1766-1771

Research output: Contribution to journalJournal articleResearchpeer-review

Modeling of Moisture Transport into an Electronic Enclosure Using the Resistor-Capacitor Approach

Staliulionis, Z., Conseil-Gudla, H., Mohanty, S., Jabbari, M., Ambat, R. & Hattel, J. H., 2018, In : Journal of Electronic Packaging. 140, 3, 11 p., 031001 .

Research output: Contribution to journalJournal articleResearchpeer-review

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Piotrowska, K., Ud Din, R., Grumsen, F. B., Jellesen, M. S. & Ambat, R., 2018, In : Journal of Electronic Materials. 47, 7, p. 4190-4207

Research output: Contribution to journalJournal articleResearchpeer-review

Transformation of iron containing constituent intermetallic particles during hydrothermal treatment

Borgaonkar, S., Din, R. U., Kasama, T. & Ambat, R., 2018, In : Thin solid Films. 649, p. 121-128

Research output: Contribution to journalJournal articleResearchpeer-review

Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, K., Jellesen, M. S. & Ambat, R., 2018, Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) . IEEE, p. 72-76

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

2017

Analysis of surface insulation resistance related failures in electronics by circuit simulation

Verdingovas, V., Joshy, S., Jellesen, M. S. & Ambat, R., 2017, In : Circuit World. 43, 2, p. 45-55

Research output: Contribution to journalJournal articleResearchpeer-review

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Verdingovas, V., Jellesen, M. S. & Ambat, R., 2017, In : Microelectronics Reliability. 73, p. 158-166

Research output: Contribution to journalJournal articleResearchpeer-review

64 Downloads (Pure)

Corrosion failure analysis of hearing aid battery-spring contacts

Gudla, V. C. & Ambat, R., 2017, In : Engineering Failure Analysis. 79, p. 980–987

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File

Corrosion in Electronics

Ambat, R., Gudla, H. V. C. & Verdingovas, V., 2017, Reference Module in Chemistry, Molecular Sciences and Chemical Engineering. Reedijk, J. (ed.). Elsevier, 10 p.

Research output: Chapter in Book/Report/Conference proceedingEncyclopedia chapterResearchpeer-review

Corrosion reliability of lead-free solder systems used in electronics

Li, F., Verdingovas, V., Medgyes, B. & Ambat, R., 2017, Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 . IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

1 Downloads (Pure)

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Li, F., Verdingovas, V., Medgyes, B. & Ambat, R., 2017, Proceedings of the European Corrosion Congress (EUROCORR 2017). 10 p. 98245

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Effect of interior geometry on local climate inside an electronic device enclosure

Joshy, S., Jellesen, M. S. & Ambat, R., 2017, Proceedings of the 16th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) . IEEE, p. 779-783

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

1 Downloads (Pure)

Electrochemical migration of lead-free solder alloys in Na2SO4 environment

Medgyes, B., Ádám, S., Tar, L., Verdingovas, V., Ambat, R. & Harsányi, G., 2017, Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017 . IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

95 Downloads (Pure)

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil, H., Staliulionis, Z., Jellesen, M. S., Jabbaribehnam, M., Hattel, J. H. & Ambat, R., 2017, In : I E E E Transactions on Components, Packaging and Manufacturing Technology. 7, 3, p. 412 - 423

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File

Influence of steam-based pre-treatment using acidic chemistries on the adhesion performance of powder coated aluminium alloy AA6060

Din, R. U., Nikogeorgos, N., Jellesen, M. S., Shabadi, R. & Ambat, R., 2017, In : Adhesion and Adhesives. 74, p. 167-176

Research output: Contribution to journalJournal articleResearchpeer-review

133 Downloads (Pure)

Interface strength and degradation of adhesively bonded porous aluminum oxides

T. Abrahami, S., M. M. de Kok, J., Gudla, V. C., Ambat, R., Terryn, H. & M. C. Mol, J., 2017, In : npj Materials Degradation . 1, 8, 8 p.

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Conseil, H., Gudla, V. C., Borgaonkar, S., Jellesen, M. S. & Ambat, R., 2017, In : Journal of Materials Science: Materials in Electronics. 28, 8, p. 6138-6151 14 p.

Research output: Contribution to journalJournal articleResearchpeer-review

1 Downloads (Pure)

Microstructural and Corrosion Issues of Embossed and Welded Aluminium Heat Exchanger Tubes

Zaffaroni, G. G. B., Gudla, V. C., Ambat, R. & Mangelsdorf, A., 2017. 15 p.

Research output: Contribution to conferencePaperResearchpeer-review

216 Downloads (Pure)

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D’Angelo, L., Verdingovas, V., Ferrero, L., Bolzacchini, E. & Ambat, R., 2017, In : IEEE Transactions on Device and Materials Reliability. 17, 4, p. 746-757

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File

Overview of humidity driven reliability issues of electronics

Ambat, R., 2017, International Conference on Infocom Technologies and Unmanned Systems (ICTUS 2017). IEEE, 1 p.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil, H., Jellesen, M. S. & Ambat, R., 2017, In : Journal of Electronic Materials. 46, 2, p. 817–825 9 p.

Research output: Contribution to journalJournal articleResearchpeer-review

156 Downloads (Pure)

Reliability of electronics to humidity-related failures

Joshy, S., Jellesen, M. S. & Ambat, R., 2017, Book of Abstracts Sustain 2017. Technical University of Denmark, 1 p. E-8

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsResearchpeer-review

Open Access
File

Steam based conversion coating on AA6060 alloy: Effect of sodium silicate chemistry and corrosion performance

Din, R. U., Bordo, K., Tabrizian, N., Jellesen, M. S. & Ambat, R., 2017, In : Applied Surface Science. 423, p. 78-89

Research output: Contribution to journalJournal articleResearchpeer-review