20122019

Research output per year

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Research Output

188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

Grass, R. S., Havreland, A. S., Engholm, M., Jensen, J. A. & Thomsen, E. V., 2019, Proceedings of the IEEE International Ultrasonic Symposium 2019. IEEE, p. 746-749

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
137 Downloads (Pure)
428 Downloads (Pure)

Imaging Performance for Two Row–Column Arrays

Bouzari, H., Engholm, M., Nikolov, S. I., Stuart, M. B., Thomsen, E. V. & Jensen, J. A., 2019, In : IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control. 66, 7, p. 1209-1221 13 p.

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
291 Downloads (Pure)

Wafer bonded CMUT technology utilizing a Poly-Silicon-on-Insulator wafer

Havreland, A. S., Engholm, M., Grass, R. S., Jensen, J. A. & Thomsen, E. V., 2019, Proceedings of the 2019 IEEE International Ultrasonics Symposium. IEEE, p. 758-761

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
122 Downloads (Pure)

Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Thomsen, E. V., Steenberg, K., Petersen, M. G., Weile, M. A., Havreland, A. S., Ommen, M. L., Grass, R. S. & Engholm, M., 2019, Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, p. 770-773

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Projects