No photo of Andreas Spandet Havreland
  • Ørsteds Plads, 345B, 049

    2800 Kgs. Lyngby

    Denmark

20162019
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Research Output 2017 2019

  • 6 Article in proceedings
  • 2 Journal article
49 Downloads (Pure)

188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

Grass, R. S., Havreland, A. S., Engholm, M., Jensen, J. A. & Thomsen, E. V., 2019, Proceedings of the IEEE International Ultrasonic Symposium 2019. IEEE, p. 746-749

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
300 Downloads (Pure)
Open Access
File
41 Downloads (Pure)

Wafer bonded CMUT technology utilizing a Poly-Silicon-on-Insulator wafer

Havreland, A. S., Engholm, M., Grass, R. S., Jensen, J. A. & Thomsen, E. V., 2019, Proceedings of the 2019 IEEE International Ultrasonics Symposium. IEEE, p. 758-761

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File

Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Thomsen, E. V., Steenberg, K., Petersen, M. G., Weile, M. A., Havreland, A. S., Ommen, M. L., Grass, R. S. & Engholm, M., 2019, Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, p. 770-773

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

179 Downloads (Pure)

A Row–Column-Addressed 2D Probe with an Integrated Compound Diverging Lens

Engholm, M., Beers, C., Havreland, A. S., Tomov, B. G., Jensen, J. A. & Thomsen, E. V., 2018, 2018 IEEE International Ultrasonics Symposium (IUS). IEEE, 4 p.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File

Projects 2016 2019