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Article in proceedings
2019

188+188 Row–Column Addressed CMUT Transducer for Super Resolution Imaging

Grass, R. S., Havreland, A. S., Engholm, M., Jensen, J. A. & Thomsen, E. V., 2019, Proceedings of the IEEE International Ultrasonic Symposium 2019. IEEE, p. 746-749

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
147 Downloads (Pure)

Deformation of single cells - Optical two-beam traps and more

Nielsen, K. S., Rungling, T. B., Dziegiel, M. H., Marie, R. & Berg-Sørensen, K., 2019, Complex Light and Optical Forces XIII. Galvez, E. J., Andrews, D. L. & Gluckstad, J. (eds.). SPIE - International Society for Optical Engineering, 9 p. 1093516. (Proceedings of SPIE - The International Society for Optical Engineering, Vol. 10935).

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
274 Downloads (Pure)

Near-IR wide field-of-view huygens metalens for outdoor imaging applications

Engelberg, J., Zhou, C., Mazurski, N., Bar-David, J., Levy, U. & Kristensen, A., 2019, Proceedings of 2019 Conference on Lasers and Electro-Optics. IEEE, Vol. 2019. (Optics Infobase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Resonant laser printing by Silicon crystallization and oxidation

Staif, J., Bar-David, J., Engelberg, J., Mazurski, N., Vakahi, A., Remennik, S., Popov, I., Kristensen, A. & Levy, U., 2019, Proceedings of the 2019 Conference on Lasers and Electro-Optics. IEEE, 2 p. 8749418. (Conference on Lasers and Electro-optics).

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
57 Downloads (Pure)

Wafer bonded CMUT technology utilizing a Poly-Silicon-on-Insulator wafer

Havreland, A. S., Engholm, M., Grass, R. S., Jensen, J. A. & Thomsen, E. V., 2019, Proceedings of the 2019 IEEE International Ultrasonics Symposium. IEEE, p. 758-761

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Open Access
File
135 Downloads (Pure)

Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Thomsen, E. V., Steenberg, K., Petersen, M. G., Weile, M. A., Havreland, A. S., Ommen, M. L., Grass, R. S. & Engholm, M., 2019, Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, p. 770-773

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review