International Microelectronics And Packaging Society
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Publications
(2)- Published
Packaged multi sensor system for fisheries research: New Test methods of package
Publication: Research - peer-review › Article in proceedings – Annual report year: 2008
- Published
An Experimental Investigation of Diffusion within Electroplated Lead-free Solder Alloy Stacks Combining Elements such as Sn, Cu, Au and/or Zn onto a Ni UBM
Publication: Research - peer-review › Article in proceedings – Annual report year: 2008
ID: 3324638