Publication: Research - peer-review › Article in proceedings – Annual report year: 2009
Molded Interconnect Devices (MIDs) are plastic substrates with electrical infrastructure. The fabrication of MIDs is usually based on injection molding and different process chains may be identified from this starting point. The use of MIDs has been driven primarily by the automotive sector, but recently the medical sector seems more and more interested. In particular the possibility of miniaturization of 3D components with electrical infrastructure is attractive. The paper describes possible manufacturing routes and challenges of miniaturized MIDs based on two component micro injection molding and subsequent metallization. The technology will be demonstrated by an industrial component.
|Title of host publication||ANTEC 2009 Annual Technical Conference, Chicago, Illinois USA : ANTEC@NPE 2009|
|Place of Publication||Chicago, Illinois USA|
|State||Published - 2009|
|Event||67th Annual Technical Conference of the Society Of Plastics Engineers 2009 - Chicago, IL, United States|
|Conference||67th Annual Technical Conference of the Society Of Plastics Engineers 2009|
|Period||22/06/2009 → 24/06/2009|
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