Two component micro injection molding for MID fabrication

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2009


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Molded Interconnect Devices (MIDs) are plastic substrates with electrical infrastructure. The fabrication of MIDs is usually based on injection molding and different process chains may be identified from this starting point. The use of MIDs has been driven primarily by the automotive sector, but recently the medical sector seems more and more interested. In particular the possibility of miniaturization of 3D components with electrical infrastructure is attractive. The paper describes possible manufacturing routes and challenges of miniaturized MIDs based on two component micro injection molding and subsequent metallization. The technology will be demonstrated by an industrial component.
Original languageEnglish
Title of host publicationANTEC 2009 Annual Technical Conference, Chicago, Illinois USA : ANTEC@NPE 2009
Place of PublicationChicago, Illinois USA
Publication date2009
StatePublished - 2009
Event67th Annual Technical Conference of the Society Of Plastics Engineers 2009 - Chicago, IL, United States


Conference67th Annual Technical Conference of the Society Of Plastics Engineers 2009
CountryUnited States
CityChicago, IL
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ID: 3470590