Two component micro injection molding for MID fabrication

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2009

Documents

View graph of relations

Molded Interconnect Devices (MIDs) are plastic substrates with electrical infrastructure. The fabrication of MIDs is usually based on injection molding and different process chains may be identified from this starting point. The use of MIDs has been driven primarily by the automotive sector, but recently the medical sector seems more and more interested. In particular the possibility of miniaturization of 3D components with electrical infrastructure is attractive. The paper describes possible manufacturing routes and challenges of miniaturized MIDs based on two component micro injection molding and subsequent metallization. The technology will be demonstrated by an industrial component.
Original languageEnglish
TitleANTEC 2009 Annual Technical Conference, Chicago, Illinois USA : ANTEC@NPE 2009
Place of publicationChicago, Illinois USA
Publication date2009
StatePublished

Conference

Conference67th Annual Technical Conference of the Society Of Plastics Engineers 2009
Number67
CountryUnited States
CityChicago, IL
Period22/06/0924/06/09
Download as:
Download as PDF
Select render style:
APAAuthorCBEHarvardMLAStandardVancouverShortLong
PDF
Download as HTML
Select render style:
APAAuthorCBEHarvardMLAStandardVancouverShortLong
HTML
Download as Word
Select render style:
APAAuthorCBEHarvardMLAStandardVancouverShortLong
Word

Download statistics

No data available

ID: 3470590