Towards a microscopic understanding of plasma activated bonding

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2004

Standard

Towards a microscopic understanding of plasma activated bonding. / Poulsen, M.; Egebjerg, A.; Bunk, O.; Nielsen, M.; Nielsen, M.M.; Feidenhans'l, R.; Jensen, F.

Semiconductor wafer bonding 7: Science, technology, and applications. Pennington, NJ : Electrochemical Society, Incorporated, 2004. p. 248-258 (Proceedings volume PV 2003-19).

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2004

Harvard

Poulsen, M, Egebjerg, A, Bunk, O, Nielsen, M, Nielsen, MM, Feidenhans'l, R & Jensen, F 2004, 'Towards a microscopic understanding of plasma activated bonding'. in Semiconductor wafer bonding 7: Science, technology, and applications. Electrochemical Society, Incorporated, Pennington, NJ, pp. 248-258. Proceedings volume PV 2003-19

APA

Poulsen, M., Egebjerg, A., Bunk, O., Nielsen, M., Nielsen, M. M., Feidenhans'l, R., & Jensen, F. (2004). Towards a microscopic understanding of plasma activated bonding. In Semiconductor wafer bonding 7: Science, technology, and applications. (pp. 248-258). Pennington, NJ: Electrochemical Society, Incorporated. (Proceedings volume PV 2003-19).

CBE

Poulsen M, Egebjerg A, Bunk O, Nielsen M, Nielsen MM, Feidenhans'l R, Jensen F. 2004. Towards a microscopic understanding of plasma activated bonding. In Semiconductor wafer bonding 7: Science, technology, and applications. Pennington, NJ: Electrochemical Society, Incorporated. pp. 248-258. (Proceedings volume PV 2003-19).

MLA

Poulsen, M. et al. "Towards a microscopic understanding of plasma activated bonding". Semiconductor wafer bonding 7: Science, technology, and applications. Pennington, NJ: Electrochemical Society, Incorporated. 2004. 248-258. (Proceedings volume PV 2003-19).

Vancouver

Poulsen M, Egebjerg A, Bunk O, Nielsen M, Nielsen MM, Feidenhans'l R et al. Towards a microscopic understanding of plasma activated bonding. In Semiconductor wafer bonding 7: Science, technology, and applications. Pennington, NJ: Electrochemical Society, Incorporated. 2004. p. 248-258. (Proceedings volume PV 2003-19).

Author

Poulsen, M.; Egebjerg, A.; Bunk, O.; Nielsen, M.; Nielsen, M.M.; Feidenhans'l, R.; Jensen, F. / Towards a microscopic understanding of plasma activated bonding.

Semiconductor wafer bonding 7: Science, technology, and applications. Pennington, NJ : Electrochemical Society, Incorporated, 2004. p. 248-258 (Proceedings volume PV 2003-19).

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2004

Bibtex

@inbook{cab1882422d6465b8538c72359de8757,
title = "Towards a microscopic understanding of plasma activated bonding",
keywords = "5-I nano",
publisher = "Electrochemical Society, Incorporated",
author = "M. Poulsen and A. Egebjerg and O. Bunk and M. Nielsen and M.M. Nielsen and R. Feidenhans'l and F. Jensen",
year = "2004",
series = "Proceedings volume PV 2003-19",
pages = "248-258",
booktitle = "Semiconductor wafer bonding 7: Science, technology, and applications",

}

RIS

TY - GEN

T1 - Towards a microscopic understanding of plasma activated bonding

A1 - Poulsen,M.

A1 - Egebjerg,A.

A1 - Bunk,O.

A1 - Nielsen,M.

A1 - Nielsen,M.M.

A1 - Feidenhans'l,R.

A1 - Jensen,F.

AU - Poulsen,M.

AU - Egebjerg,A.

AU - Bunk,O.

AU - Nielsen,M.

AU - Nielsen,M.M.

AU - Feidenhans'l,R.

AU - Jensen,F.

PB - Electrochemical Society, Incorporated

CY - Pennington, NJ

PY - 2004

Y1 - 2004

KW - 5-I nano

BT - Semiconductor wafer bonding 7: Science, technology, and applications

T2 - Semiconductor wafer bonding 7: Science, technology, and applications

T3 - Proceedings volume PV 2003-19

T3 - en_GB

SP - 248

EP - 258

ER -