Towards a microscopic understanding of plasma activated bonding

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2004

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Original languageEnglish
TitleSemiconductor wafer bonding 7: Science, technology, and applications
Place of publicationPennington, NJ
PublisherElectrochemical Society, Incorporated
Publication date2004
Pages248-258
StatePublished

Conference

Conference203rd Meeting of the Electrochemical Society
Number203
CountryFrance
CityParis
Period28/04/0330/04/03
Internet addresshttp://www.electrochem.org/meetings/biannual/203/203exhibit.htm
NameProceedings volume PV 2003-19
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