Topology optimization of metallic devices for microwave applications

Publication: Research - peer-reviewJournal article – Annual report year: 2010

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In electromagnetic optimization problems of metallic radio-frequency devices, such as antennas and resonators for wireless energy transfer, the volumetric distribution of good conductors, e.g. copper, has been known to cause numerical bottlenecks. In finite element analysis the limiting factor is the skin depth, which calls for highly refined meshing in order to capture the physics. The skin depth problem has therefore prohibited the application of topology optimization to this class of problem. We present a design parameterization that remedies these numerical issues, by the interpolation of Maxwell's equations and a fictitious element impedance condition. The validity of the proposed design parameterization is confirmed by several numerical examples.
Original languageEnglish
JournalInternational Journal for Numerical Methods in Engineering
Publication date2010
Volume83
Issue2
Pages228-248
ISSN0029-5981
DOIs
StatePublished
CitationsWeb of Science® Times Cited: 4

Keywords

  • electromagnetics, topology optimization, antenna design, finite elements, microwaves
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