Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

Publication: Research - peer-reviewJournal article – Annual report year: 2010

Standard

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. / Sopousek, J.; Palcut, Marián; Hodúlová, Erika; Janovec, Jozef.

In: Journal of Electronic Materials, Vol. 39, No. 3, 2010, p. 312-317.

Publication: Research - peer-reviewJournal article – Annual report year: 2010

Harvard

Sopousek, J, Palcut, M, Hodúlová, E & Janovec, J 2010, 'Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy' Journal of Electronic Materials, vol 39, no. 3, pp. 312-317., 10.1007/s11664-009-1070-2

APA

CBE

Sopousek J, Palcut M, Hodúlová E, Janovec J. 2010. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. Journal of Electronic Materials. 39(3):312-317. Available from: 10.1007/s11664-009-1070-2

MLA

Vancouver

Sopousek J, Palcut M, Hodúlová E, Janovec J. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. Journal of Electronic Materials. 2010;39(3):312-317. Available from: 10.1007/s11664-009-1070-2

Author

Sopousek, J.; Palcut, Marián; Hodúlová, Erika; Janovec, Jozef / Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy.

In: Journal of Electronic Materials, Vol. 39, No. 3, 2010, p. 312-317.

Publication: Research - peer-reviewJournal article – Annual report year: 2010

Bibtex

@article{62de26eaf3a1494d84937859f2a05711,
title = "Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy",
publisher = "Springer New York LLC",
author = "J. Sopousek and Marián Palcut and Erika Hodúlová and Jozef Janovec",
year = "2010",
doi = "10.1007/s11664-009-1070-2",
volume = "39",
number = "3",
pages = "312--317",
journal = "Journal of Electronic Materials",
issn = "0361-5235",

}

RIS

TY - JOUR

T1 - Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

A1 - Sopousek,J.

A1 - Palcut,Marián

A1 - Hodúlová,Erika

A1 - Janovec,Jozef

AU - Sopousek,J.

AU - Palcut,Marián

AU - Hodúlová,Erika

AU - Janovec,Jozef

PB - Springer New York LLC

PY - 2010

Y1 - 2010

N2 - The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

AB - The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

KW - Solid Oxide Fuel Cells

KW - Fuel Cells and hydrogen

KW - Brændselsceller og brint

U2 - 10.1007/s11664-009-1070-2

DO - 10.1007/s11664-009-1070-2

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 3

VL - 39

SP - 312

EP - 317

ER -