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Thick photoresist coating for electrode patterning in anisotropically etched v-grooves is investigated. The photoresist coverage is compared with and without soft baking. Two-step exposure is applied for a complete exposure and minimizing the resolution loss.
Original languageEnglish
TitleProceedings, OFC
PublisherIEEE
Publication date2009
Pages1-3
ISBN (print)978-1-4244-2606-5
StatePublished

Conference

ConferenceThe Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference, OFC/NFOEC
CountryUnited States
CitySan Diego, CA
Period22-03-0926-03-09

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