Microprobe metrology for direct sheet resistance and mobility characterization

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2012

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The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.
Original languageEnglish
TitleProceedings of the 12th International Workshop on Junction Technology
Number of pages6
Publication date2012
DOIs
StatePublished

Conference

Conference12th International Workshop on Junction Technology
Number12th
CountryChina
CityShanghai
Period14/05/1215/05/12
CitationsWeb of Science® Times Cited: No match on DOI

Keywords

  • Accuracy, Loading, Probes
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