Investigation of Photolithography Process on SPOs for the ATHENA Mission

Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2015

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As part of the ongoing effort to optimize the throughput of the Athena optics we have produced mirrors with a state-of-the-art cleaning process. We report on the studies related to the importance of the photolithographic process. Pre-coating characterization of the mirrors has shown and still shows photoresist remnants on the SiO2- rib bonding zones, which influences the quality of the metallic coating and ultimately the mirror performance. The size of the photoresist remnants is on the order of 10 nm which is about half the thickness of final metallic coating. An improved photoresist process has been developed including cleaning with O2 plasma in order to remove the remaining photoresist remnants prior to coating. Surface roughness results indicate that the SiO2-rib bonding zones are as clean as before the photolithography process is performed.
Original languageEnglish
Title of host publicationProceedings of SPIE
Volume9603
PublisherSPIE - International Society for Optical Engineering
Publication date2015
Article number96030M
DOIs
StatePublished - 2015
EventOptics for EUV, X-Ray, and Gamma-Ray Astronomy VII - San Diego, United States

Conference

ConferenceOptics for EUV, X-Ray, and Gamma-Ray Astronomy VII
LocationSan Diego Convention Center
CountryUnited States
CitySan Diego
Period10/08/201513/08/2015
SeriesProceedings of SPIE, the International Society for Optical Engineering
Volume9603
ISSN0277-786X

Bibliographical note

Copyright 2015 Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic electronic or print reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.

CitationsWeb of Science® Times Cited: 2

    Keywords

  • Athena, Silicon Pore Optics (SPO), AFM, SEM, Photoresist, Surface Roughness, Photolithography Process, O2 Plasma, Stacking
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