Investigation of Electronic Corrosion at Device Level

Publication: Research - peer-reviewConference article – Annual report year: 2010

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Investigation of Electronic Corrosion at Device Level. / Jellesen, Morten Stendahl; Minzari, Daniel; Rathinavelu, Umadevi; Møller, Per; Ambat, Rajan.

In: E C S Transactions, Vol. 25, No. 30, 2010, p. 1-14.

Publication: Research - peer-reviewConference article – Annual report year: 2010

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Author

Jellesen, Morten Stendahl; Minzari, Daniel; Rathinavelu, Umadevi; Møller, Per; Ambat, Rajan / Investigation of Electronic Corrosion at Device Level.

In: E C S Transactions, Vol. 25, No. 30, 2010, p. 1-14.

Publication: Research - peer-reviewConference article – Annual report year: 2010

Bibtex

@article{30eb96d813374a5384861fe59ebb2636,
title = "Investigation of Electronic Corrosion at Device Level",
publisher = "Electrochemical Society, Inc.",
author = "Jellesen, {Morten Stendahl} and Daniel Minzari and Umadevi Rathinavelu and Per Møller and Rajan Ambat",
note = "Copyright The Electrochemical Society, Inc. [2010]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).",
year = "2010",
doi = "10.1149/1.3321952",
volume = "25",
number = "30",
pages = "1--14",
journal = "E C S Transactions",
issn = "1938-5862",

}

RIS

TY - CONF

T1 - Investigation of Electronic Corrosion at Device Level

A1 - Jellesen,Morten Stendahl

A1 - Minzari,Daniel

A1 - Rathinavelu,Umadevi

A1 - Møller,Per

A1 - Ambat,Rajan

AU - Jellesen,Morten Stendahl

AU - Minzari,Daniel

AU - Rathinavelu,Umadevi

AU - Møller,Per

AU - Ambat,Rajan

PB - Electrochemical Society, Inc.

PY - 2010

Y1 - 2010

N2 - This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

AB - This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

UR - http://dx.doi.org/10.1149/1.3321952

U2 - 10.1149/1.3321952

DO - 10.1149/1.3321952

JO - E C S Transactions

JF - E C S Transactions

SN - 1938-5862

IS - 30

VL - 25

SP - 1

EP - 14

ER -