Investigation of Electronic Corrosion at Device Level

Publication: Research - peer-reviewConference article – Annual report year: 2010

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This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.
Original languageEnglish
JournalE C S Transactions
Issue number30
Pages (from-to)1-14
StatePublished - 2010
EventECS Meeting : Corrosion of Electronic and Magnetic Materials - Vienna, Austria


ConferenceECS Meeting : Corrosion of Electronic and Magnetic Materials
CityVienna, Austria
Period01/01/2009 → …

Bibliographical note

Copyright The Electrochemical Society, Inc. [2010]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).

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