SU-8 is the preferred photoresist for development and fabrication of high aspect ratio (HAR) three dimensional patterns. However, processing of SU-8 is a challenging task, especially when the film thickness as well as the aspect ratio is increasing and the size of the features is close to the resolution limit of photolithography. This paper describes process optimization for the fabrication of dense SU-8 micropillar arrays (2.5μm spacing) with nominal height ⩾20μm and nominal diameter ⩽2.5μm (AR ⩾8). Two approaches, differing in temperature, ramping rate and duration of the baking steps were compared as part of the photolithographic processing, in order to evaluate the effect of baking on the pattern resolution. Additionally, during the post-processing, supercritical point drying and hard baking were introduced yielding pillars with diameter 1.8μm, AR=11 and an improved temporal stability.