Evolution of the microstructure in nanocrystalline copper electrodeposits during room temperature storage
Publication: Research - peer-review › Conference article – Annual report year: 2007
The microstructure evolution in copper electrodeposits at room temperature (self-annealing) was investigated by means of X-ray diffraction analysis and simultaneous measurement of the electrical resistivity as a function of time. In-situ studies were started immediately after electrodeposition and continued with an unprecedented time resolution until stationary values of the recorded data were obtained. Independent of the copper layer thickness, the as-deposited microstructure consisted of nanocrystalline grains with orientation dependent crystallite sizes. Orientation dependent grain growth, crystallographic texture changes by multiple twinning and a decrease of the electrical resistivity occurred as a function of time at room temperature. The kinetics of self-annealing is strongly affected by the layer thickness: the thinner the layer the slower is the microstructure evolution and self-annealing is suppressed completely for a thin layer of 0.4 mu m.
|Journal||Zeitschrift fuer Kristallographie|
|Journal number||suppl. 26|
|Period||01/01/06 → …|
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