Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Publication: Research - peer-reviewJournal article – Annual report year: 2009

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Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.
Original languageEnglish
JournalI E E E Transactions on Device and Materials Reliability
Publication date2009
Volume9
Issue3
Pages392-402
ISSN1530-4388
DOIs
StatePublished

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Copyright: 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

CitationsWeb of Science® Times Cited: 12

Keywords

  • Environmental testing, Corrosion testing, Failure, Tin, Electrochemical analysis
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