Effect on deformation process of adding a copper core to multifilament MgB2 superconducting wire

Publication: Research - peer-reviewJournal article – Annual report year: 2007

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Using the PIT method, multifilament wire with different packing strategies has been manufactured. In all, three types of wire have been investigated, a 19-filament configuration using ex-situ powder in an Fe-matrix and two 8-filament configurations in an Fe-matrix applying a copper core, one using in-situ and another using ex-situ powder. The effect on the annealing requirements during mechanical processing of adding such a copper core has been investigated. The results show that the number of required annealings drops by about a factor of one half with the addition of a copper core. This finding is supported by numerical simulations of the deformation process which indicate that tensile stresses are. concentrated around the middle of the wire during the drawing process. As such, strategic packing of the multifilament configuration can reduce the need for annealing during the mechanical deformation process. It is also found that the multifilament configuration using in-situ powder requires less annealing than the ex-situ counterpart. This is most likely due to the fact that in-situ powder is more readily compacted than ex-situ powder.
Original languageEnglish
JournalI E E E Transactions on Applied Superconductivity
Publication date2007
Volume17
Issue2
Pages3054-3058
ISSN1051-8223
DOIs
StatePublished

Bibliographical note

Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

CitationsWeb of Science® Times Cited: 0

Keywords

  • superconducting filaments and wires, superconducting materials mechanical factors, superconducting composites, magnesium diboride
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