Effect of iodine on the corrosion of Au-Al wire bonds

Publication: Research - peer-reviewJournal article – Annual report year: 2015

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Corrosion study was performed on Au-Al wire bonds, thin layers of sputter deposited Au and Al, and Au-Al intermetallic nuggets. The test environment was iodine-vapour in air (1. mg/L) at 85 °C with varying relative humidity, and 500 mg/L of KI in water. GDOES, XRD, SEM EDS, wire bond shear, and electrochemical testing were used to characterize the samples. Failures of Au-Al wire bonds were found to be primarily attributed to the corrosion of Al via formation of Al iodides and consequent formation of Al oxides and/or hydroxides. Most susceptible to corrosion are Al metallization and Al rich intermetallic phases.
Original languageEnglish
JournalCorrosion Science
Volume97
Pages (from-to)161-171
ISSN0010-938X
DOIs
StatePublished - 2015
CitationsWeb of Science® Times Cited: 7

    Keywords

  • A. Aluminium, A. Electronic materials, A. Intermetallics, B. Polarisation, B. X-ray diffraction, C. Interfaces
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