Compressibility and thermal expansion of cubic silicon nitride

Publication: Research - peer-reviewJournal article – Annual report year: 2002

Standard

Compressibility and thermal expansion of cubic silicon nitride. / Jiang, Jianzhong; Lindelov, H.; Gerward, Leif; Ståhl, Kenny; Recio, R.M.; Mori-Sanchez, P.; Carlson, S.; Mezouar, M.; Dooryhee, E.; Fitch, A.; Frost, D.J.

In: Physical Review B (Condensed Matter and Materials Physics), Vol. 65, No. 16, 2002, p. 161202.

Publication: Research - peer-reviewJournal article – Annual report year: 2002

Harvard

Jiang, J, Lindelov, H, Gerward, L, Ståhl, K, Recio, RM, Mori-Sanchez, P, Carlson, S, Mezouar, M, Dooryhee, E, Fitch, A & Frost, DJ 2002, 'Compressibility and thermal expansion of cubic silicon nitride' Physical Review B (Condensed Matter and Materials Physics), vol 65, no. 16, pp. 161202., 10.1103/PhysRevB.65.161202

APA

CBE

Jiang J, Lindelov H, Gerward L, Ståhl K, Recio RM, Mori-Sanchez P, Carlson S, Mezouar M, Dooryhee E, Fitch A, Frost DJ. 2002. Compressibility and thermal expansion of cubic silicon nitride. Physical Review B (Condensed Matter and Materials Physics). 65(16):161202. Available from: 10.1103/PhysRevB.65.161202

MLA

Vancouver

Author

Jiang, Jianzhong; Lindelov, H.; Gerward, Leif; Ståhl, Kenny; Recio, R.M.; Mori-Sanchez, P.; Carlson, S.; Mezouar, M.; Dooryhee, E.; Fitch, A.; Frost, D.J. / Compressibility and thermal expansion of cubic silicon nitride.

In: Physical Review B (Condensed Matter and Materials Physics), Vol. 65, No. 16, 2002, p. 161202.

Publication: Research - peer-reviewJournal article – Annual report year: 2002

Bibtex

@article{70ba56a74c694aa08831a764d5402b4a,
title = "Compressibility and thermal expansion of cubic silicon nitride",
keywords = "SPINEL PHASE, BETA-SI3N4, SI3N4",
publisher = "American Physical Society",
author = "Jianzhong Jiang and H. Lindelov and Leif Gerward and Kenny Ståhl and R.M. Recio and P. Mori-Sanchez and S. Carlson and M. Mezouar and E. Dooryhee and A. Fitch and D.J. Frost",
note = "Copyright (2002) American Physical Society",
year = "2002",
doi = "10.1103/PhysRevB.65.161202",
volume = "65",
number = "16",
pages = "161202",
journal = "Physical Review B (Condensed Matter and Materials Physics)",
issn = "1098-0121",

}

RIS

TY - JOUR

T1 - Compressibility and thermal expansion of cubic silicon nitride

A1 - Jiang,Jianzhong

A1 - Lindelov,H.

A1 - Gerward,Leif

A1 - Ståhl,Kenny

A1 - Recio,R.M.

A1 - Mori-Sanchez,P.

A1 - Carlson,S.

A1 - Mezouar,M.

A1 - Dooryhee,E.

A1 - Fitch,A.

A1 - Frost,D.J.

AU - Jiang,Jianzhong

AU - Lindelov,H.

AU - Gerward,Leif

AU - Ståhl,Kenny

AU - Recio,R.M.

AU - Mori-Sanchez,P.

AU - Carlson,S.

AU - Mezouar,M.

AU - Dooryhee,E.

AU - Fitch,A.

AU - Frost,D.J.

PB - American Physical Society

PY - 2002

Y1 - 2002

N2 - The compressibility and thermal expansion of the cubic silicon nitride (c-Si3N4) phase have been investigated by performing in situ x-ray powder-diffraction measurements using synchrotron radiation, complemented with computer simulations by means of first-principles calculations. The bulk compressibility of the c-Si3N4 phase originates from the average of both Si-N tetrahedral and octahedral compressibilities where the octahedral polyhedra are less compressible than the tetrahedral ones. The origin of the unit cell expansion is revealed to be due to the increase of the octahedral Si-N and N-N bond lengths with temperature, while the lengths for the tetrahedral Si-N and N-N bonds remain almost unchanged in the temperature range 295-1075 K.

AB - The compressibility and thermal expansion of the cubic silicon nitride (c-Si3N4) phase have been investigated by performing in situ x-ray powder-diffraction measurements using synchrotron radiation, complemented with computer simulations by means of first-principles calculations. The bulk compressibility of the c-Si3N4 phase originates from the average of both Si-N tetrahedral and octahedral compressibilities where the octahedral polyhedra are less compressible than the tetrahedral ones. The origin of the unit cell expansion is revealed to be due to the increase of the octahedral Si-N and N-N bond lengths with temperature, while the lengths for the tetrahedral Si-N and N-N bonds remain almost unchanged in the temperature range 295-1075 K.

KW - SPINEL PHASE

KW - BETA-SI3N4

KW - SI3N4

UR - http://link.aps.org/doi/10.1103/PhysRevB.65.161202

U2 - 10.1103/PhysRevB.65.161202

DO - 10.1103/PhysRevB.65.161202

JO - Physical Review B (Condensed Matter and Materials Physics)

JF - Physical Review B (Condensed Matter and Materials Physics)

SN - 1098-0121

IS - 16

VL - 65

SP - 161202

ER -