Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications
Publication: Research - peer-review › Article in proceedings – Annual report year: 2003
| Original language | English |
|---|---|
| Title | Proceedings of the 53rd Electronic Components and Technology Conference (ECTC) |
| Publication date | 2003 |
| Pages | 634-639 |
| ISBN (print) | 0-7803-7791-5 |
| State | Published |
Conference
| Conference | 53rd Electronic Components and Technology Conference |
|---|---|
| Period | 01-01-03 → … |
Bibliographical note
Copyright: 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE
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