An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications

Research output: Research - peer-reviewJournal article – Annual report year: 2018

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We report an adhesive bonding approach using hydrogen silsesquioxane (HSQ) for silicon carbide (SiC) samples. A hybrid light-emitting diode (LED) was successfully fabricated through bonding a near-ultraviolet (NUV) LED grown on a commercial 4H-SiC substrate to a free-standing boron-nitrogen co-doped fluorescent-SiC epi-layer. The bonding quality and the electrical performance of the hybrid LED device were characterized. Neither voids nordefectswereobservedwhichindicatesagoodbondingqualityoftheproposedHSQapproach.Astrongwarm white emission was successfully obtained from the hybrid LED through an electric current injection of 30mA.
Original languageEnglish
JournalMaterials Science in Semiconductor Processing
Volume91
Pages (from-to)9-12
ISSN1369-8001
DOIs
StatePublished - 2019
CitationsWeb of Science® Times Cited: No match on DOI

    Research areas

  • Hydrogen silsesquioxane bonding, Fluorescent-silicon carbide, Warm white light-emitting diodes
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