The project falls in two stages. First a reliable process has to be set up using the new compound semiconductor processing equipment, such that isolated "standard components" can be fabricated. This will also include grating fabrication using a newly installed e-beam writer. The focus will be components for high-speed optical communication systems in the 1.55mm wavelength range thus employing InGaAsP on InP. Next, when the growth apparatus (Emcore D125) has been installed, integration of mode-locked lasers with signal processing devices will be performed.