• Published

  High-temperature lead-free solder alternatives

  Publication: Research - peer-review › Journal article – Annual report year: 2011

• Published

  Development of lead-free solders for high-temperature applications

  Publication: Research › Ph.d. thesis – Annual report year: 2010

• Published

  Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

  Publication: Research - peer-review › Journal article – Annual report year: 2010

View all »

• Journal of Microelectronics and Electronic Packaging

  ISSNs: 1551-4897

  International Microelectronics and Packaging Society, United States

  FI (2012): 1, ISI indexed (2012): no

  Central database

  Journal

• Materials & Design

  ISSNs: 0264-1275

  Elsevier Ltd., United Kingdom

  FI (2012): 1, ISI indexed (2012): no

  Central database

  Journal

• Journal of Alloys and Compounds

  ISSNs: 0925-8388

  Elsevier BV, Netherlands

  FI (2012): 1, ISI indexed (2012): yes

  Central database

  Journal

View all »

• Completed

  Modelling of Solidification and Interdiffusion in Lead Free Solder Materials

  Project: PhD

• Technical University of Denmark (DTU)

  Local database

  Publisher

• International Microelectronics and packaging Society

  Local database

  Publisher