Publications
(6)- Published
Four point bending setup for characterization of semiconductor piezoresistance
Publication: Research - peer-review › Journal article – Annual report year: 2008
- Published
Determination of packaging induced 3D stress utilizing a piezocoefficient mapping device
Publication: Research - peer-review › Article in proceedings – Annual report year: 2007
- Published
Piezoresistance in Strained Silicon and Strained Silicon Germanium : Group IV Semiconductor Nanostructures
Publication: Research - peer-review › Article in proceedings – Annual report year: 2007
Review of Scientific Instruments
ISSNs: 0034-6748
American Institute of Physics, United States
FI (2012): 1, ISI indexed (2012): yes
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ID: 2172757