Marián Palcut

  1. 2012
  2. Published
  3. Published
  4. 2010
  5. Published
  6. Published

    Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. / Sopousek, J.; Palcut, Marián; Hodúlová, Erika; Janovec, Jozef.

    In: Journal of Electronic Materials, Vol. 39, No. 3, 2010, p. 312-317.

    Publication: Research - peer-reviewJournal article – Annual report year: 2010

  7. 2009
  8. Published

    Spectral Properties of Novel 1,3-oxazol-5(4H)-ones With Substituted Benzylidene and Phenyl Rings. / Palcut, Marián.

    In: Acta Chimica Slovenica, Vol. 56, No. 2, 2009, p. 362-368.

    Publication: Research - peer-reviewJournal article – Annual report year: 2009

  9. Published

    The interpretation of the DSC signals of the lead-free solder alloy systems using the CALPHAD approach. / Sopousek, Jiri; Palcut, Marián.

    Proceedings. 2009.

    Publication: ResearchConference abstract in proceedings – Annual report year: 2009

  10. Published

    Thermal analysis of selected tin-based lead-free solder alloys. / Palcut, Marián; Sopoušek, J.; Trnková, L.; Hodúlová, E.; Szewczyková, B.; Ožvold, M.; Turňa, M.; Janovec, J.

    In: Kovove Materialy, Vol. 47, No. 1, 2009, p. 43-50.

    Publication: Research - peer-reviewJournal article – Annual report year: 2009

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