Frank Engel Rasmussen

  1. 2012
  2. Published

    A Test Device for a Speaker Module for a Listening Device. / Jørgensen, Ivan Harald Holger (Inventor); Rasmussen, Frank Engel (Inventor).

    Patent No.: EP12158242.3.Mar 06, 2012.

    Publication: ResearchPatent – Annual report year: 2013

  3. 2004
  4. Published

    Deep Reactive Ion Etching for High Aspect Ratio Microelectromechanical Components. / Jensen, Søren; Yalcinkaya, Arda Deniz; Jacobsen, S.; Rasmussen, T.; Rasmussen, Frank Engel; Hansen, Ole.

    In: Physica Scripta. Topical Issues, Vol. T114, 2004, p. 188-192.

    Publication: Research - peer-reviewJournal article – Annual report year: 2004

  5. 2003
  6. Published

    Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications. / Rasmussen, Frank Engel; Heschel, M.; Hansen, Ole.

    In: Proceedings of the 53rd Electronic Components and Technology Conference (ECTC). 2003. p. 634-639.

    Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2003

  7. Published

    Deep Reactive Ion Etching for High Aspect Ratio Microelectromechanical Components. / Jensen, Søren; Yalcinkaya, Arda Deniz; Jacobsen, S.; Rasmussen, T.; Rasmussen, Frank Engel; Hansen, Ole.

    In: Nordic Semiconductor Meeting Paper 1040. Tampere, Finland, 2003.

    Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2003

  8. Published

    Development and Characterisation of KOH Resistant PECVD Silicon Nitride for Microsystems Applications. / Rasmussen, Frank Engel; Geilman, Berit; Heschel, M.; Hansen, Ole; Jørgensen, Anders Michael.

    In: Proceedings of the International Symposium on Dielectrics in Emerging Technologies. 2003. p. 218-229.

    Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2003

  9. Published

    Electrical Interconnections Through CMOS Wafers. / Rasmussen, Frank Engel.

    2003. 244 p.

    Publication: ResearchPh.d. thesis – Annual report year: 2003

  10. Published

    Fabrication of High Aspect Ratio Through-Wafer Vias in CMOS Wafers for 3-D Packaging Applications. / Rasmussen, Frank Engel; Frech, J.; Heschel, M.; Hansen, Ole.

    In: Proceedings of the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers). Vol. 2 IEEE, 2003. p. 1659-1662.

    Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2003

  11. 2001
  12. Published
  13. 2000
  14. Published

    Elecroplating and characterization of cobalt-nickel-iron for magnetic microsystems applications.. / Rasmussen, Frank Engel; Ravnkilde, Jan Tue; Tang, Peter Torben; Hansen, Ole; Bouwstra, Siebe.

    In: EuroSensors. Elsevier, 2000.

    Publication: Research - peer-reviewArticle in proceedings – Annual report year: 2000