• Published

  A Test Device for a Speaker Module for a Listening Device

  Publication: Research › Patent – Annual report year: 2013

• Published

  Deep Reactive Ion Etching for High Aspect Ratio Microelectromechanical Components

  Publication: Research - peer-review › Journal article – Annual report year: 2004

• Published

  Fabrication of High Aspect Ratio Through-Wafer Vias in CMOS Wafers for 3-D Packaging Applications

  Publication: Research - peer-review › Article in proceedings – Annual report year: 2003

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• Physica Scripta. Topical Issues

  ISSNs: 0281-1847

  Kungliga Vetenskapsakademien, Sweden

  FI (2012): 1, ISI indexed (2012): no

  Central database

  Journal

• Sensors and Actuators A: Physical

  ISSNs: 0924-4247, 09244247

  Elsevier S.A., Switzerland

  FI (2012): 2, ISI indexed (2012): yes

  Central database

  Journal

• Completed

  Electronical interconnections through CMOS Wafers

  Project: PhD

• Elsevier

  Local database

  Publisher

• IEEE, 0-7803

  Central database

  Publisher