Journal of Electronic Materials

ISSNs: 0361-5235, 03615235

ISSNs (Electronic): 1543-186X

Springer New York LLC, United States

BFI (2015): BFI-level 1, ISI indexed (2013): ISI indexed yes

Central database

Journal

  1. 2015
  2. Published
  3. 2013
  4. Published
  5. Published

    Kinetics, Stability, and Thermal Contact Resistance of Nickel–Ca3Co4O9 Interfaces Formed by Spark Plasma Sintering. / Holgate, Tim; Wu, NingYu; Søndergaard, M.; Iversen, B.B.

    In: Journal of Electronic Materials, Vol. 42, No. 7, 2013, p. 1661-1668.

    Publication: Research - peer-reviewJournal article – Annual report year: 2012

  6. Published
  7. Published

    Thermoelectric Properties of Li-Intercalated ZrSe2 Single Crystals. / Holgate, Tim; Liu, Yufei; Hitchcock, Dale; Tritt, Terry M.; He, Jian.

    In: Journal of Electronic Materials, Vol. 42, No. 7, 2013, p. 1751-1755.

    Publication: Research - peer-reviewJournal article – Annual report year: 2013

  8. 2012
  9. Published
  10. 2011
  11. Published

    High-temperature Thermoelectric and Microstructural Characteristics of Ga Substituted on the Co-site in Cobalt-based Oxides. / Van Nong, Ngo; Yanagiya, S.; Sonne, Monica; Pryds, Nini; Ohtaki, M.

    In: Journal of Electronic Materials, Vol. 40, No. 5, 2011, p. 716-722.

    Publication: Research - peer-reviewJournal article – Annual report year: 2011

  12. Improved Thermoelectric Characteristics of Si-doped Misfit-layered Cobaltite. / Liu, Chia-Jyi; Huang, Yu-Chih; Ngo Van, Nong; Liu, Yen-Liang; Petŕićek, V.

    In: Journal of Electronic Materials, Vol. 40, No. 5, 2011, p. 1042-1045.

    Publication: Research - peer-reviewJournal article – Annual report year: 2011

  13. Published

    Thermoelectric Properties of SnO2 Ceramics Doped with Sb and Zn. / Yanagiya, S.; Van Nong, Ngo; Xu, Jianxiao Jackie; Sonne, Monica; Pryds, Nini.

    In: Journal of Electronic Materials, Vol. 40, No. 5, 2011, p. 674-677.

    Publication: Research - peer-reviewJournal article – Annual report year: 2011

  14. 2010
  15. Published

    Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. / Sopousek, J.; Palcut, Marián; Hodúlová, Erika; Janovec, Jozef.

    In: Journal of Electronic Materials, Vol. 39, No. 3, 2010, p. 312-317.

    Publication: Research - peer-reviewJournal article – Annual report year: 2010

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